6
The over-current function will trip at a peak inductor current
(I
PEAK)
determined by:
DS ON
)
where I
OCSET
is the internal OCSET current source (200
μ
A
typical). The OC trip point varies mainly due to the MOSFET’s
r
DS(ON)
variations. To avoid over-current tripping in the normal
operating load range, find the R
OCSET
resistor from the
equation above with:
1. The maximum r
DS(ON)
at the highest junction
temperature.
2. The minimum I
OCSET
from the specification table.
3. Determine I
PEAK
for I
PEAK
> I
OUT(MAX)
+ (
I)/2,
where
I is the output inductor ripple current.
For an equation for the ripple current see the section under
component guidelines titled ‘Output Inductor Selection’.
A small ceramic capacitor should be placed in parallel with
R
OCSET
to smooth the voltage across R
OCSET
in the
presence of switching noise on the input voltage.
Output Voltage Program
The output voltage of a HIP6008 converter is programmed to
discrete levels between 2.0VDC and 3.5VDC. The voltage
identification (VID) pins program an internal voltage
reference (DACOUT) with a 4-bit digital-to-analog converter
(DAC). The level of DACOUT also sets the PGOOD and
OVP thresholds. Table 1 specifies the DACOUT voltage for
the 16 combinations of open or short connections on the VID
pins. The output voltage should not be adjusted while the
converter is delivering power. Remove input power before
changing the output voltage. Adjusting the output voltage
during operation could toggle the PGOOD signal and
exercise the overvoltage protection.
The DAC function is a precision non-inverting summation
amplifier shown in Figure 5. The resistor values shown are
only approximations of the actual precision values used.
Grounding any combination of the VID pins increases the
DACOUT voltage. The ‘open’ circuit voltage on the VID pins
is the band gap reference voltage, 1.26V.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
O
S
0A
0V
TIME (20ms/DIV)
5A
10A
15A
2V
4V
FIGURE 4. OVER-CURRENT OPERATION
I
PEAK
=
I
---------------------------------------------------
R
TABLE 1. OUTPUT VOLTAGE PROGRAM
PIN NAME
NOMINAL
DACOUT
VOLTAGE
VID3
VID2
VID1
VID0
1
1
1
1
2.0
1
1
1
0
2.1
1
1
0
1
2.2
1
1
0
0
2.3
1
0
1
1
2.4
1
0
1
0
2.5
1
0
0
1
2.6
1
0
0
0
2.7
0
1
1
1
2.8
0
1
1
0
2.9
0
1
0
1
3.0
0
1
0
0
3.1
0
0
1
1
3.2
0
0
1
0
3.3
0
0
0
1
3.4
0
0
0
0
3.5
NOTE: 0 = Connected to GND or V
SS
, 1 = OPEN
HIP6008