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參數(shù)資料
| 型號： | HDSP-2353 |
| 英文描述： | Extended Temperature Four Character 5.0 mm (0.20 Inch) 5 x 7 Alphanumeric Display for Sunlight Viewable Applications(應(yīng)用于日光觀察的擴展溫度四字符5.0 mm (0.20 英寸) 5 x 7 文字?jǐn)?shù)字顯示器) |
| 中文描述： | 擴展溫度4個字符5.0毫米（0.20英寸）5 × 7字符顯示的陽光可視應(yīng)用（應(yīng)用于日光觀察的擴展溫度四字符5.0毫米（0.20英寸），5 × 7文字?jǐn)?shù)字顯示器） |
| 文件頁數(shù)： | 9/12頁 |
| 文件大小： | 307K |
| 代理商： | HDSP-2353 |
9
environment. The metal plate
must be mechanically fastened to
the housing assembly, otherwise
it will act only as a thermal
capacitor and will not dissipate
the heat.
3. Install a heat pipe between
the display packages and the
PC board, with the heat pipe
mechanically fastened to the
chassis housing, as shown in
Figure 9b.
The heat pipe is a low mass
alternative to the metal plate
described above. A heat pipe is a
small tube, filled with a chemical,
that transfers heat from the source
to a heat sink with minimal
thermal impedance. It is not a
heat sink. The heat pipe transfers
the heat directly from the display
ceramic package to the chassis
housing which dissipates the heat
into the surrounding air.
4. Utilize a heat pipe to transfer
the heat from a maximum
metalized PC board to a finned
heat sink mounted on the back of
the assembly housing, as shown
in Figure 10.
The heat pipe is placed against
the back side of a maximum
metalized PC board, electrically
isolated by a thermally conductive
insulator. When the heat pipe
is connected to a finned heat
sink on the back of the chassis
housing, PC board to external
ambient thermal resistance values
in the range of 10 to 15
°
C/W
per device can be achieved. The
heat generated by the displays
is directly dissipated into the
external ambient surrounding the
chassis housing by the finned
heat sink.
Contact the following manu-
facturers for information on:
Heat Pipe Technology:
Noren Products
3545 Haven Avenue
Menlo Park, CA 94025
(650) 365-0632
Thermally Conductive
Insulators; “Sil-Pad”:
Bergquist Company
5300 Edina Industrial Blvd.
Minneapolis, MN 55435
(612) 835-2322
PD=P(I
CC)
+ P(I
REF
) + P(I
COL
); Total power
dissipation per device.
Where: P(I
CC
) = I
CC
(V
B
= 0.4 V) ˙ V
CC
; Power
dissipated by the two ICs when the display is
blanked.
P(I
REF
) = 5 ˙ [I
CC
(V
B
= 2.4 V) – I
CC
(V
B
= 0.4 V)]
˙ V
CC
˙ (n/35) ˙ DF; Additional power dissipated
by the two ICs with characters illuminated.
P(I
COL
) = 5 ˙ I
COL
˙ V
COL
(n/35) ˙ DF; Power
dissipated by the LED pixels when the characters
are illuminated.
n = 15 pixels per character for average power.
n = 20 pixels per character for maximum power.
Figure 6a. Equations for Calculating Device Power
Dissipation.
Delta T
J
(IC) = R
θ
J-PIN
˙ PD; IC junction
temperature rise above device pin temperature.
Where: R
θ
J-PIN
= 10
°
C/W; The thermal resistance
IC junction to device pin 1.
Delta T
PIN
= R
θ
PIN-A
˙ PD; Device pin temperature
rise above the ambient temperature, T
A
.
Where: R
θ
PIN-A
= The thermal resistance, device
pin to ambient through the PC board, on a per
device basis.
T
J
(IC) = T
A
+ [Delta T
J
(IC) + Delta T
PIN
]; IC
junction temperature, the sum of the ambient
temperature and the temperature rise above
ambient.
Figure 6b. Equations for Calculating IC Junction.
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