參數(shù)資料
型號： HDSP-2353
英文描述： Extended Temperature Four Character 5.0 mm (0.20 Inch) 5 x 7 Alphanumeric Display for Sunlight Viewable Applications(應用于日光觀察的擴展溫度四字符5.0 mm (0.20 英寸) 5 x 7 文字數(shù)字顯示器)
中文描述： 擴展溫度4個字符5.0毫米（0.20英寸）5 × 7字符顯示的陽光可視應用（應用于日光觀察的擴展溫度四字符5.0毫米（0.20英寸），5 × 7文字數(shù)字顯示器）
文件頁數(shù)： 8/12頁
文件大?。?/td> 307K
代理商： HDSP-2353
8
Where: 5(t + T + TB) is
1/column refresh rate
The column driver inputs should
be strobed at a refresh rate of
100 Hz or faster to achieve a
flicker free display. The value
of DF approaches 20% when
TB = 0 and t is very small
compared to T.
The ESD susceptibility of these
IC devices is Class A of
MIL-STD-883 or Class 2 of
DOD-STD-1686 and
DOD-HDBK-263.
For information on interfacing
these displays to microprocessor
data sources and techniques for
intensity control, see
Application
Note 1016.
Power Dissipation and
Low Thermal Resistance
Design Considerations
The light output of the
HDSP-235X devices is a function
of temperature, decreasing 1.5%
for each 1
°
C increase in junction
temperature. Therefore, it is
desirable to maintain as low
device junction temperature as
possible to insure sufficient light
output for sunlight readability.
This is preferably achieved by
designing for a low junction to
ambient thermal resistance, or
alternatively by controlling total
display power dissipation by
derating, see data sheet Figure 2.
Power Dissipation
Calculation:
Power dissipation may be
calculated using the equations of
Figure 6a. For typical applications,
the average pixel count per
character is 15. The maximum
power dissipation is calculated
with a pixel count of 20 per
character. As demonstrated in
Figure 6c, the maximum power
dissipation is 1.741 W with DF =
20%, V
CC
= 5.25 V and V
COL
=
3.5 V. The average power
dissipation is 1.161 W per device
with DF = 20%, V
CC
= 5.0 V
and V
COL
= 3.5 V.
As shown in Figure 4 on the data
sheet, the column current, I
COL
, is
constant when the column input
voltage, V
COL
, is at 2.75 V or
greater. Setting V
COL
substantially
greater than 2.75 V does not
increase light output, but does add
to device total power dissipation.
For optimum performance, it is
recommended that V
COL
be set
between 2.75 V and 3.5 V.
Junction Temperature and
Device Thermal Resistance:
It is necessary to control the IC
junction temperature, T
J
(IC), to
insure proper operation of the
display:
T
J
(IC)MAX = 125
°
C
The equations to calculate T
J
(IC)
are given in Figure 6b. T
J
(IC)
will be higher than the device
substrate temperature where as
the individual LED pixel junction
temperatures, T
J
(LED), will be
nearly the same as the substrate
temperature. A sample calculation
is presented in Figure 6c.
An easy design rule is to obtain
an IC junction to ambient thermal
resistance, R
θ
J-A
, that establishes
the device pin temperature less
than 100
°
C. The value of R
θ
J-A
= 23
°
C/W will permit device
operation in an ambient tempera-
ture of 85
°
C, without derating.
Figure 7 gives the maximum
values for R
θ
J-A
for reliable
device operation in ambient
temperatures from 25
°
C to 85
°
C.
To achieve a low value of R
θ
PIN-A
,
the following designs may be
incorporated into the display
system:
1. Mount the displays on a double
sided maximum metalized PC
board, as illustrated in Figure 8.
For single line display assemblies,
a double sided maximum
metalized PC board is a cost
effective way to achieve a low
thermal resistance to ambient.
“Lands” are sued instead of
“traces” as the current carrying
elements. Each “l(fā)and” is made as
wide as possible, consistent with
circuit layout restrictions, to
achieve metalized surface area to
radiate thermal energy. Isolation
strips, 0.64 mm (0.025 inch)
wide, are etched from the board
to electrically isolate the lands.
PC board thermal resistance
values in the range of 35
°
C/W per
device are achievable for single
line display assemblies. Air flow
across the display PC board
assembly dissipates the heat.
2. Install a metal plate, or bar,
between the display packages
and the PC board, with the bar
mechanically fastened to the
chassis, as illustrated in Figure 9a.
For multiple display lines, a metal
plate may be placed between the
display packages and the PC
board to conduct the heat to the
chassis housing assembly. The
metal plate may be electrically
insulated from the PC board by a
thermally conductive insulator.
Heat sink bars are formed in the
metal plate by milling out lead
clearance slots. The ceramic
package of a display rests on one
of the heat sink bars with the
device leads passing through the
slots to make electrical contact
with the PC board. The heat is
transferred from the display
ceramic package into the metal
plate. The chassis housing acts as
the thermal radiator to dissipate
the heat into the surrounding
相關(guān)PDF資料
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HDSP-2530 Eight Character 5 mm Smart Alphanumeric Display(八字符5 mm 智能文字數(shù)字顯示器)
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參數(shù)描述
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HDSP-2501 功能描述:LED 顯示器和配件 Yellow 585nm 5x7 Smart Display RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
HDSP-2502 功能描述:LED 顯示器和配件 Red 626nm 5x7 Smart Display RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
HDSP2502 制造商:Avago Technologies 功能描述:LED DISPLAY ALPHANUMERIC
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