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參數(shù)資料
| 型號(hào)： | GTL2034PW |
| 廠(chǎng)商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 電壓/頻率轉(zhuǎn)換 |
| 英文描述： | 4-bit GTL to GTL buffer |
| 封裝： | GTL2034PW<SOT402-1 (TSSOP14)|<<http://www.nxp.com/packages/SOT402-1.html<1<Always Pb-free,;GTL2034PW<SOT402-1 (TSSOP14)|<<http://www.nxp.com/packages/SOT402-1.html<1&l |
| 文件頁(yè)數(shù)： | 11/13頁(yè) |
| 文件大?。?/td> | 83K |
| 代理商： | GTL2034PW |
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9397 750 13543
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 November 2005
11 of 13
Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 11:
Acronym
CDM
ESD
GTL
HBM
MM
TTL
Abbreviations
Description
Charged Device Model
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Machine Model
Transistor-Transistor Logic
Table 12:
Document ID
GTL2034_1
Revision history
Release date
20051111
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 13543
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GTL2034PW,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 4-BIT GTL-GTL BUFFER RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2034PW,118 | 功能描述:緩沖器和線(xiàn)路驅(qū)動(dòng)器 4-BIT GTL TO GTL BUF RoHS:否 制造商:Micrel 輸入線(xiàn)路數(shù)量:1 輸出線(xiàn)路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| GTL2107 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:12-bit GTL−/GTL/GTL+ to LVTTL translator |
| GTL2107PW | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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