參數(shù)資料
型號(hào)： GTL2010BS
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 其它接口
英文描述： 10-bit bidirectional low voltage translator
中文描述： SPECIALTY INTERFACE CIRCUIT, DSO24
封裝： 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-616-1, HVQFN-24
文件頁(yè)數(shù)： 16/20頁(yè)
文件大小： 117K
代理商： GTL2010BS
GTL2010_6
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 3 March 2008
16 of 20
NXP Semiconductors
GTL2010
10-bit bidirectional low voltage translator
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 13
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13
and
14
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 13
.
Table 13.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 14.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GTL2010BS,118 功能描述:轉(zhuǎn)換 - 電壓電平 VOLT TRANSLATOR RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
GTL2010BS-T 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:NXP bidirectional low-voltage translators
GTL2010DB 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:VOLTAGE CLAMP|MOS|TSSOP|24PIN|PLASTIC
GTL2010PW 制造商:NXP Semiconductors 功能描述:IC GTL LO-VOLT TRANSLATOR 24 制造商:NXP Semiconductors 功能描述:IC, GTL LO-VOLT TRANSLATOR, 24TSSOP 制造商:NXP Semiconductors 功能描述:IC, GTL LO-VOLT TRANSLATOR, 24TSSOP; No. of Inputs:10; Propagation Delay:250ps; Supply Voltage Min:2.3V; Supply Voltage Max:2.7V; Logic Case Style:TSSOP; No. of Pins:24; Logic Type:Bidirectional Low Voltage Translator; Operating ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Voltage Level Translator GTL/GTL+ to LVTTL/TTL 24-Pin TSSOP Tube
GTL2010PW,112 功能描述:轉(zhuǎn)換 - 電壓電平 1-BIT GTL VOLTAGE CLAMP TRANS RoHS:否 制造商:Micrel 類(lèi)型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
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