參數(shù)資料
型號(hào): GS88136
廠商: GSI TECHNOLOGY
英文描述: 8Mb(256K x 36Bit)ByteSafe Synchronous Burst SRAM(8M位(256K x 36位)ByteSafe同步靜態(tài)RAM(帶2位脈沖地址計(jì)數(shù)器))
中文描述: 8MB的(256 × 36Bit)ByteSafe同步突發(fā)靜態(tài)存儲(chǔ)器(800萬(wàn)位(256K × 36位)ByteSafe同步靜態(tài)隨機(jī)存儲(chǔ)器(帶2位脈沖地址計(jì)數(shù)器))
文件頁(yè)數(shù): 13/33頁(yè)
文件大?。?/td> 463K
代理商: GS88136
Rev: 1.11 9/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
13/33
2000, Giga Semconductor, Inc.
Preliminary
GS88118/36T-11/11.5/100/80/66
Capacitance
(T
A
= 25
o
C, f = 1 MH
Z
, V
DD
= 3.3 V)
Note: These parameters are sample tested.
Package Thermal Characteristics
Notes:
1.
Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
SCMI G-38-87
Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1
2.
3.
Parameter
Symbol
C
IN
C
I/O
Test conditions
V
IN
= 0 V
V
OUT
= 0 V
Typ.
Max.
Unit
Input Capacitance
4
5
pF
Input/Output Capacitance
6
7
pF
Rating
Layer Board
Symbol
R
Θ
JA
R
Θ
JA
R
Θ
JC
Max
Unit
°
C/W
Notes
Junction to Ambient (at 200 lfm)
single
40
1,2
Junction to Ambient (at 200 lfm)
four
24
°
C/W
1,2
Junction to Case (TOP)
9
°
C/W
3
20% tKC
V
SS
– 2.0 V
50%
V
SS
V
IH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
V
DD
+ 2.0 V
50%
V
DD
V
IL
相關(guān)PDF資料
PDF描述
GS88118 8Mb(512K x 18Bit) ByteSafe Synchronous Burst SRAM(8M位(512K x 18位)ByteSafe同步靜態(tài)RAM(帶2位脈沖地址計(jì)數(shù)器))
GS881E18T 512K x 18, 256K x 36 ByteSafe 8Mb Sync Burst SRAMs
GS881E36T-100I 512K x 18, 256K x 36 ByteSafe 8Mb Sync Burst SRAMs
GS881E36T-11 512K x 18, 256K x 36 ByteSafe 8Mb Sync Burst SRAMs
GS881E36T-11.5 512K x 18, 256K x 36 ByteSafe 8Mb Sync Burst SRAMs
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