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參數(shù)資料
| 型號： | FP1189-G |
| 英文描述： | 1/2 - Watt HFET |
| 中文描述： | 1 / 2 -瓦特異質(zhì)結(jié)場效應(yīng)晶體管 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 516K |
| 代理商： | FP1189-G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September 2004
FP1189
- Watt HFET
Product Information
FP1189 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical drain biasing condition
of +8V, 125 mA at an 85
°
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
°
C.
Rating
-40 to +85
°
C
68
°
C/W
153
°
C
Product Marking
The FP1189 will be marked with an
“FP1189” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +235
°
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Passes
/
500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 2000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
0
1
10
100
60
70
80
90
100
110
120
Tab Temperature (°C)
M
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FP1189-PCB1900S | 1/2 - Watt HFET |
| FP1189-PCB2140S | 1/2 - Watt HFET |
| FP1189-PCB900S | 1/2 - Watt HFET |
| FP1189-RFID | 1/2 - Watt HFET |
| FP1189 | HFETs |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FP1189-PCB1900S | 功能描述:射頻開發(fā)工具 1900MHz Eval Brd 15.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| FP1189-PCB2140S | 功能描述:射頻開發(fā)工具 2140MHz Eval Brd 14.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| FP1189-PCB900S | 功能描述:射頻開發(fā)工具 900MHz Eval Brd 20.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| FP1189-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:1/2 - Watt HFET |
| FP1189TR-G | 制造商:TriQuint Semiconductor 功能描述:RF SMALL SIGNAL TRANSISTOR HFET |
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