Revision 10 1-21 Thermal Characteristics The temperature variable in the Designer software refers to the junction temperature, not" />
參數(shù)資料
型號(hào)： EX64-TQG64A
廠商： Microsemi SoC
文件頁(yè)數(shù)： 18/48頁(yè)
文件大小： 0K
描述： IC FPGA ANTIFUSE 3K 64-TQFP
標(biāo)準(zhǔn)包裝： 160
系列： EX
邏輯元件/單元數(shù)： 128
輸入/輸出數(shù)： 41
門數(shù)： 3000
電源電壓： 2.3 V ~ 2.7 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 64-LQFP
供應(yīng)商設(shè)備封裝： 64-TQFP（10x10）
eX Family FPGAs
Revision 10
1-21
Thermal Characteristics
The temperature variable in the Designer software refers to the junction temperature, not the ambient
temperature. This is an important distinction because the heat generated from dynamic power
consumption is usually hotter than the ambient temperature. EQ 1, shown below, can be used to
calculate junction temperature.
EQ 1
Junction Temperature =
T + Ta(1)
Where:
Ta = Ambient Temperature
T = Temperature gradient between junction (silicon) and ambient = ja * P
P = Power
ja = Junction to ambient of package. ja numbers are located in the "Package Thermal Characteristics"
section below.
Package Thermal Characteristics
The device junction-to-case thermal characteristic is
jc, and the junction-to-ambient air characteristic is
ja. The thermal characteristics for ja are shown with two different air flow rates. jc is provided for reference.
The maximum junction temperature is 150
C.
The maximum power dissipation allowed for eX devices is a function of
ja. A sample calculation of the
absolute maximum power dissipation allowed for a TQFP 100-pin package at commercial temperature
and still air is as follows:
Package Type
Pin Count
jc
ja
Units
Still Air
1.0 m/s
200 ft/min
2.5 m/s
500 ft/min
Thin Quad Flat Pack (TQFP)
64
12.0
42.4
36.3
34.0
C/W
Thin Quad Flat Pack (TQFP)
100
14.0
33.5
27.4
25.0
C/W
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
–
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
150
C70C
–
33.5
C/W
-------------------------------------
2.39W
=
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參數(shù)描述
EX64-TQG64I 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
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