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參數(shù)資料
| 型號(hào)： | EVAL-AD5501EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 19/20頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD5501 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| DAC 的數(shù)量： | 1 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 16M |
| 數(shù)據(jù)接口： | SPI?、QSPI?、MICROWIRE? 和 DSP |
| 設(shè)置時(shí)間： | 45µs |
| DAC 型： | 電壓 |
| 工作溫度： | -40°C ~ 105°C |
| 已供物品： | 板 |
| 已用 IC / 零件： | AD5501 |
AD5501
Data Sheet
Rev. C | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter
Rating
V
DD to AGND
0.3 V to +64 V
V
LOGIC to DGND
0.3 V to +7 V
V
OUT to AGND
0.3 V to V
DD + 0.3 V
Digital Input to DGND
0.3 V to V
LOGIC + 0.3 V
SDO Output to DGND
0.3 V to V
LOGIC + 0.3 V
AGND to DGND
0.3 V to +0.3 V
Maximum Junction Temperature
(T
J Maximum)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature Range
20 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Thermal resistance is for a JEDEC 4-layer (2S2P) printed circuit
board (PCB).
Table 6. Thermal Resistance
Package Type
θ
JA
Unit
16-Lead TSSOP
112.60
°C/W
ESD CAUTION
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