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| 型號： | EVAL-AD5379EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 4/29頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR AD5379 |
| 產(chǎn)品培訓模塊： | DAC Architectures |
| 標準包裝： | 1 |
| DAC 的數(shù)量： | 40 |
| 位數(shù)： | 14 |
| 采樣率（每秒）： | 50k |
| 數(shù)據(jù)接口： | 串行，并聯(lián) |
| 設置時間： | 20µs |
| DAC 型： | 電壓 |
| 工作溫度： | -40°C ~ 85°C |
| 已供物品： | 板，CD |
| 已用 IC / 零件： | AD5379 |
| 相關產(chǎn)品： | AD5379ABCZ-ND - IC DAC 14BIT 40CHAN 108CSPBGA AD5379ABC-ND - IC DAC 14BIT 40CH 108-CSPBGA |
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AD5379
Rev. B | Page 11 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Transient currents of up to 100 mA do not cause SCR latch-up.
Table 6.
Parameter
Rating
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, and functional operation of the device at these or
any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
VDD to AGND
0.3 V to +17 V
VSS to AGND
17 V to +0.3 V
VCC to DGND
0.3 V to +7 V
Digital Inputs to DGND
0.3 V to VCC + 0.3 V
Digital Outputs to DGND
0.3 V to VCC + 0.3 V
VREF1(+), VREF2(+) to AGND
0.3 V to +7 V
VREF1(), VREF2() to AGND
VSS 0.3 V to VDD + 0.3 V
VBIAS to AGND
0.3 V to +7 V
VOUT0–VOUT39 to AGND
VSS 0.3 V to VDD + 0.3 V
REFGND to AGND
VSS 0.3 V to VDD + 0.3 V
AGND to DGND
0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial (A Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
108-Lead CSPBGA Package
θJA Thermal Impedance
37.5°C/W
θJC Thermal Impedance
8.5°C/W
Reflow Soldering
Peak Temperature
230°C
Time at Peak Temperature
10 sec to 40 sec
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
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