參數(shù)資料
型號: EDS1232AABB-60L
英文描述: Programmable VCOM; Temperature Range: -40°C to 85°C; Package: 24-QFN T&R
中文描述: 內(nèi)存| 4X1MX32 |的CMOS | BGA封裝| 90PIN |塑料
文件頁數(shù): 34/55頁
文件大?。?/td> 570K
代理商: EDS1232AABB-60L
EDS1232AABB, EDS1232AATA
Data Sheet E0205E30 (Ver. 3.0)
4
CONTENTS
Description .................................................................................................................................................... 1
Features ........................................................................................................................................................ 1
Ordering Information ..................................................................................................................................... 2
Part Number .................................................................................................................................................. 2
Pin Configurations ......................................................................................................................................... 3
Electrical Specifications................................................................................................................................. 5
Block Diagram ............................................................................................................................................. 10
Pin Function ................................................................................................................................................ 11
Command Operation ................................................................................................................................... 12
Truth Table .................................................................................................................................................. 16
Simplified State Diagram............................................................................................................................. 22
Programming Mode Registers .................................................................................................................... 23
Mode Register ............................................................................................................................................. 24
Power-up sequence .................................................................................................................................... 27
Operation of the SDRAM ............................................................................................................................ 28
Timing Waveforms ...................................................................................................................................... 44
Package Drawing ........................................................................................................................................ 51
Recommended Soldering Conditions.......................................................................................................... 53
Revision History .......................................................................................................................................... 56
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