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參數(shù)資料
| 型號： | ECP203G |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 2 Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 2瓦特，高線性InGaP HBT功率放大器 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 194K |
| 代理商： | ECP203G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
OCtober 2004
ECP203
2 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECP203D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Land Pattern
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
0.65mm
TYP.
TYP.
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
4.00mm
16L 4.0mm X 4.0mm PACKAGE
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
800 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
Rating
-40 to +85
q
C
17.5
q
C / W
155
q
C
Product Marking
The component will be marked with an
“ECP203D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
16
15
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2.
Ground / thermal vias are critical for the proper performance
of this device. Vias
should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8
All dimensions are in millimeters (inches). Angles are in
degrees.
1
2
3
4
12
11
10
9
14
13
5
6
7
N
8
N
N/C
RF OUT
RF OUT
N/C
Vref
N/C
RF IN
N/C
V
N
N
N
N
N
MTTF vs. GND Tab Temperature
100
1000
10000
100000
60
70
80
90
100
110
120
Tab Temperature (°C)
M
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