參數(shù)資料
型號： ECP203G
廠商： Electronic Theatre Controls, Inc.
英文描述： 2 Watt, High Linearity InGaP HBT Amplifier
中文描述： 2瓦特，高線性InGaP HBT功率放大器
文件頁數(shù)： 2/3頁
文件大?。?/td> 194K
代理商： ECP203G
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
OCtober 2004
ECP203
2 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECP203G (SOIC-8 Package) Mechanical Information
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
800 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
Rating
-40 to +85
q
C
17.5
q
C / W
155
q
C
Product Marking
The component will be marked with an
“ECP203G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
2
3
4
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Function
Vref
Input
Output
Vbias
GND
N/C or GND
Pin No.
1
3
6, 7
8
Backside Paddle
2, 4, 5
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2.
Ground / thermal vias are critical for the proper performance
of this device.
Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8
All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
60
70
80
90
100
110
120
Tab Temperature (°C)
M
1
8
7
6
5
相關PDF資料
PDF描述
ECP203G-PCB2450 2 Watt, High Linearity InGaP HBT Amplifier
ECP203G-PCB2650 2 Watt, High Linearity InGaP HBT Amplifier
ECQUNxxx Interference Suppression Capacitor
ECQV Designed for application where high density insertion of components is required.
ECQV50VDC Stacked Metallized Film Capacitor
相關代理商/技術參數(shù)
參數(shù)描述
ECP203G-G 功能描述:射頻放大器 2300-2700MHz +32dBm P1dB RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
ECP203G-PCB2450 功能描述:射頻開發(fā)工具 2450MHz Eval Brd 10dB Gain RoHS:否 制造商:Taiyo Yuden 產品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V
ECP203G-PCB2650 功能描述:射頻開發(fā)工具 2650MHz Eval Brd 9.5dB Gain RoHS:否 制造商:Taiyo Yuden 產品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V
ECP20UD12 制造商:XPPOWER 制造商全稱:XP Power Limited 功能描述:PCB Mount
ECP20UD15 制造商:XP Power 功能描述:20 WATT, LOW PROFILE, 0.73', CLASS II CONSTRUCTION, PCB MOUNTING
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*