參數(shù)資料
型號: DS90LV804TSQX/NOPB
廠商: National Semiconductor
文件頁數(shù): 14/15頁
文件大?。?/td> 0K
描述: IC BUFFER/REPEATR LVDS 4CH 32LLP
標準包裝: 4,500
類型: 緩沖器
Tx/Rx類型: LVDS
延遲時間: 3.2ns
電容 - 輸入: 3.5pF
電源電壓: 3.15 V ~ 3.45 V
電流 - 電源: 140mA
安裝類型: 表面貼裝
封裝/外殼: 32-WFQFN 裸露焊盤
供應商設備封裝: 32-LLP-EP(5x5)
包裝: 帶卷 (TR)
其它名稱: DS90LV804TSQX
PO
W
ER
SU
PPL
Y
C
U
R
EN
T
(mA)
350
0
BIT DATA RATE (Gbps)
50
100
150
200
250
300
PRBS-23
Clock
0
0.25
0.5
0.75
1.0
SNLS195L – SEPTEMBER 2005 – REVISED APRIL 2013
Typical Performance Characteristics
A. Dynamic power supply current was measured while running a clock or PRBS 223-1 pattern with all 4 channels active. VCC = 3.3V, TA =
+25°C, VID = 0.5V, VCM = 1.2V
Figure 6. Power Supply Current vs Bit Data Rate
PACKAGING INFORMATION
The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance
chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The
small size and very low profile make this package ideal for high density PCBs used in small-scale electronic
applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no
Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the
edge of the package. This feature offers a visible solder fillet after board mounting.
The WQFN has the following advantages:
Low thermal resistance
Reduced electrical parasitics
Improved board space efficiency
Reduced package height
Reduced package mass
For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe
Package".
8
Copyright 2005–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV804
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