±5ppm, I2C Real-Time Clock with SRAM 2 Maxim Integrated Voltage Range on" />
參數(shù)資料
型號(hào)： DS3232MZ+
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/23頁(yè)
文件大小： 0K
描述： IC RTC W/SRAM I2C 8SOIC
標(biāo)準(zhǔn)包裝： 100
類型： 時(shí)鐘/日歷
特點(diǎn)： 警報(bào)器，閏年，方波輸出，SRAM
存儲(chǔ)容量： 236B
時(shí)間格式： HH:MM:SS（12/24 小時(shí)）
數(shù)據(jù)格式： YY-MM-DD-dd
接口： I²C，2 線串口
電源電壓： 2.3 V ~ 4.5 V
電壓 - 電源，電池： 2.3 V ~ 4.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SOIC
包裝： 管件
DS3232M
±5ppm, I2C Real-Time Clock with SRAM
2
Maxim Integrated
Voltage Range on Any Pin Relative to GND ........-0.3V to +6.0V
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -55NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
ELECTRICAL CHARACTERISTICS—FREQUENCY AND TIMEKEEPING
(VCC or VBAT = +3.3V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3.3V, VBAT = +3.0V, and
TA = +25NC, unless otherwise noted.) (Note 2)
DC ELECTRICAL CHARACTERISTICS—GENERAL
(VCC = +2.3V to +4.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3.3V, VBAT = +3.0V, and
TA = +25NC, unless otherwise noted.) (Note 2)
SO
Junction-to-Ambient Thermal Resistance (
qJA) ........120°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
1Hz Frequency Tolerance
D
f/fOUT
Measured over R 10s interval
Q
5
ppm
1Hz Frequency Stability vs. VCC
Voltage
D
f/V
Q
1
ppm/V
Timekeeping Accuracy
tKA
Q
0.432
Seconds/
Day
32kHz Frequency Tolerance
D
f/fOUT
Q
2.5
%
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
2.3
3.3
4.5
V
VBAT
2.3
3.0
4.5
Logic 1
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0
VIL
-0.3
0.3 x
VCC
V
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Active Supply Current
(I2C Active)
ICCA
(Note 3)
125
250
A
Standby Supply Current
(I2C Inactive)
ICCS
(Notes 3, 4)
100
175
A
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