Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 2 Maxim Integrated DS3231 ABS" />
參數(shù)資料
型號(hào)： DS3231SN#T&R
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/20頁(yè)
文件大小： 0K
描述： IC RTC W/TCXO 16-SOIC
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 1,000
類型： 時(shí)鐘/日歷
特點(diǎn)： 警報(bào)器，閏年，方波輸出，TCXO/晶體
時(shí)間格式： HH:MM:SS（12/24 小時(shí)）
數(shù)據(jù)格式： YY-MM-DD-dd
接口： I²C，2 線串口
電源電壓： 2.3 V ~ 5.5 V
電壓 - 電源，電池： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 16-SOIC W
包裝： 帶卷 (TR)
Extremely Accurate I2C-Integrated
RTC/TCXO/Crystal
2
Maxim Integrated
DS3231
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(TA = TMIN to TMAX, unless otherwise noted.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on Any Pin Relative to Ground......-0.3V to +6.0V
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)....73°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1) ......23°C/W
Operating Temperature Range
DS3231S ..............................................................0°C to +70°C
DS3231SN ........................................................-40°C to +85°C
Junction Temperature ......................................................+125°C
Storage Temperature Range ...............................-40°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2 times max)..................+260°C
(See the
Handling, PC Board Layout, and Assembly section.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
2.3
3.3
5.5
V
Supply Voltage
VBAT
2.3
3.0
5.5
V
Logic 1 Input SDA, SCL
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0 Input SDA, SCL
VIL
-0.3
0.3 x
VCC
V
ELECTRICAL CHARACTERISTICS
(VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC =
3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC = 3.63V
200
Active Supply Current
ICCA
(Notes 4, 5)
VCC = 5.5V
300
μA
VCC = 3.63V
110
Standby Supply Current
ICCS
I2C bus inactive, 32kHz
output on, SQW output off
(Note 5)
VCC = 5.5V
170
μA
VCC = 3.63V
575
Temperature Conversion Current
ICCSCONV
I2C bus inactive, 32kHz
output on, SQW output off
VCC = 5.5V
650
μA
Power-Fail Voltage
VPF
2.45
2.575
2.70
V
Logic 0 Output, 32kHz,
INT/SQW, SDA
VOL
IOL = 3mA
0.4
V
Logic 0 Output,
RST
VOL
IOL = 1mA
0.4
V
Output Leakage Current 32kHz,
INT/SQW, SDA
ILO
Output high impedance
-1
0
+1
μA
Input Leakage SCL
ILI
-1
+1
μA
RST Pin I/O Leakage
IOL
RST high impedance (Note 6)
-200
+10
μA
VBAT Leakage Current
(VCC Active)
IBATLKG
25
100
nA
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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