
DATA SHEET CX77304-16
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
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July 28, 2004 Skyworks Proprietary and Confidential Information Products and Product Information are Subject to Change Without Notice. 101944B
Electrostatic Discharge Sensitivity
The CX77304-16 is a Class I device. Figure 9 lists the
Electrostatic Discharge (ESD) immunity level for each pin of the
CX77304-16 product. The numbers in Figure 9 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation. The ESD testing was
performed in compliance with MIL-STD-883E Method 3015.7
using the Human Body Model. If ESD damage threshold
magnitude is found to consistently exceed 2000 volts on a given
pin, this so is indicated. If ESD damage threshold below 2000
volts is measured for either polarity, numbers are indicated that
represent worst case values observed in product characterization.
Figure 9. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria that fail
devices as soon as the pin begins to show any degradation on a
curve tracer.
To avoid ESD damage, latent or visible, it is very important the
Class-1 ESD handling precautions listed below are used in the
product assembly and test areas.
Personnel Grounding
-
Wrist Straps
-
Conductive Smocks, Gloves and Finger Cots
-
Antistatic ID Badges
Facility
-
Relative Humidity Control and Air Ionizers
-
Dissipative Floors (less than 109
to GND)
Protective Workstation
-
Dissipative Table Tops
-
Protective Test Equipment (Properly Grounded)
-
Grounded Tip Soldering Irons
-
Conductive Solder Suckers
-
Static Sensors
Protective Packaging & Transportation
-
Bags and Pouches (Faraday Shield)
-
Protective Tote Boxes (Conductive Static Shielding)
-
Protective Trays
-
Grounded Carts
-
Protective Work Order Holders
Technical Information
CMOS Bias Controller Characteristics
The CMOS die within the PAM performs several functions that are
important to the overall module performance. Some of these
functions must be considered for development of the power
ramping features in a 3GPP compliant transmitter power control
loop. Power ramping considerations will be discussed later in this
section.
NOTE:
Please refer to 3GPP TS 05.05, Digital Cellular Communications
System (Phase 2+); Radio Transmission and Reception. All
GSM specifications are now the responsibility of 3GPP. The
standards are available at
http://www.3GPP.org/specs/specs.htm
The four main functions described in this section are Standby
Mode Control, Band Select, Voltage Clamp, and Current Buffer.
The functional block diagram is shown in Figure 10.
Figure 10. Functional Block Diagram