87
IMP, Inc.
Process C3014
CMOS 3
μ
m
5 Volt Single Metal Analog
Electrical Characteristics
T=25
o
C Unless otherwise noted
Maximum
Unit
0.8
V
V
1/2
52
μ
A/V
2
2.6
μ
m
μ
m
V
V
ISO 9001 Registered
N-Channel Transistor
Threshold Voltage
Body Factor
Conduction Factor
Effective Channel Length
Width Encroachment
Punch Through Voltage
Poly Field Threshold Voltage
Symbol
VT
N
γ
N
β
N
Leff
N
W
N
BVDSS
N
VTF
P(N)
Minimum
0.5
42
2.0
Typical
0.65
0.6
47
2.3
0.7
Comments
100x3
μ
m
100x3
μ
m
100x100
μ
m
100x3
μ
m
Per side
12
12
P-Channel Transistor
Threshold Voltage
Body Factor
Conduction Factor
Effective Channel Length
Width Encroachment
Punch Through Voltage
Poly Field Threshold Voltage
Symbol
VT
P
γ
P
β
P
Leff
P
W
P
BVDSS
P
VTF
P(P)
Minimum
–0.5
13
2.85
Typical
0.65
0.55
15
3.2
0.9
Maximum
–0.8
19
3.55
Unit
V
V
1/2
μ
A/V
2
μ
m
μ
m
V
V
Comments
100x3
μ
m
100x3
μ
m
100x100
μ
m
100x3
μ
m
Per side
–12
–12
Diffusion & Thin Films
Well (field) Sheet Resistance
N+ Sheet Resistance
N+ Junction Depth
P+ Sheet Resistance
P+ Junction Depth
Gate Oxide Thickness
Interpoly Oxide Thickness
Gate Poly Sheet Resistance
Bottom Poly Sheet Res.
Metal-1 Sheet Resistance
Passivation Thickness
Symbol
ρ
P-well(f)
N+
x
jN+
ρ
P+
x
jP+
T
GOX
T
P1P2
ρ
POLY1
ρ
POLY2
ρ
M1
T
PASS
Minimum
3.2
16
Typical
4.8
21
0.8
80
0.7
48
60
22
30
30
200+900
Maximum
6.5
27
Unit
K
/
o
/
o
μ
m
/
o
μ
m
nm
nm
/
o
/
o
m
/
o
nm
Comments
P-well
50
100
44
15
20
52
30
40
60
oxide+nit.
Capacitance
Gate Oxide
Metal-1 to Poly-1
Metal-1 to Silicon
Poly-1 to Poly-2
Symbol
C
OX
C
M1P
C
M1S
C
P1P2
Minimum
0.66
Typical
0.72
0.0523
0.030
0.57
Maximum
0.78
Unit
fF/
μ
m
2
fF/
μ
m
2
fF/
μ
m
2
fF/
μ
m
2
Comments
0.026
0.51
0.034
0.63