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| 型號(hào)： | BXM80526B500128 |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 48/81頁 |
| 文件大?。?/td> | 598K |
| 代理商： | BXM80526B500128 |
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Mobile Intel
Celeron Processor (0.18μ) in BGA2 and Micro-PGA2 Packages
Datasheet
Order Number#249563-001
48
Figure 20. Surface-mount BGA2 Package - Bottom View
NOTE:
All dimensions are in millimeters. Dimensions in figure are for reference only. See Table 27 for
specifications.
5.2
Socketable Micro-PGA2 Package Dimensions
The mobile Intel Celeron processor is also packaged in a PPGA-B495 package (also known as
Micro-PGA2) with the back of the processor die exposed on top. Unlike previous mobile
processors with exposed die, the back of the mobile Intel Celeron processor die may be polished
and very smooth. The mechanical specifications for the socketable package are provided in Table
28. Figure 21 shows the top and side views of the socketable package, and Figure 22 shows the
bottom view of the socketable package. The substrate may only be contacted within the region
between the keep-out outline and the edge of the substrate. The mobile Intel Celeron processor
will have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region, and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Unlike the BGA2 package, VID implementation does not require
VID pins to be depopulated on the Micro-PGA2 package.
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