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參數(shù)資料
| 型號(hào)： | BU-61582G2-270 |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), MIL-STD-1553 CONTROLLER, CDSO70 |
| 封裝： | CERAMIC PACKAGE-70 |
| 文件頁(yè)數(shù)： | 3/8頁(yè) |
| 文件大小： | 78K |
| 代理商： | BU-61582G2-270 |
3
70
36
35
1
1.000 (MAX)
1.900 MAX
0.018
±0.002
PIN 1 DENOTED BY
INDEX MARK
0.050 TYP
34 EQ. SP. @
0.050 = 1.700
(TOL. NONCUM)
PIN NUMBERS ARE
FOR REF. ONLY
0.080 MIN
0.190
±0.010
0.040 TYP
0.050 MIN
0.012 MAX
1.024 MAX
1.38
±0.02
0.065 (REF)
0.010
±0.002
0.215
MAX
INDEX DENOTES PIN 1
NOTES:
1. DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. PACKAGE MATERIAL: ALUMINA (AL2O3).
3. LEAD MATERIAL: KOVAR, PLATED BY 150
MINIMUM NICKEL, PLATED BY 50 MINIMUM GOLD.
BU-61582GX, 70-PIN GULL LEAD CERAMIC PACKAGE MECHANICAL OUTLINE
70
36
35
1
0.015
± 0.002 TYP
(0.381
± 0.051)
1.900 MAX
(48.26)
34 EQ SP @ 0.050 = 1.700
(43.18) (1.27) TOL NONCUM
0.050 TYP
(1.27)
0.400 MIN TYP
(10.16)
INDEX DENOTES PIN 1
1.000 MAX
(25.4)
0.215 (5.46) MAX
0.010
± 0.002 TYP
(0.254
± 0.051)
0.070
± 0.010
(1.78)
PIN NUMBERS
FOR REF ONLY
TOP VIEW
SIDE VIEW
NOTES:
1. DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. PACKAGE MATERIAL: ALUMINA (AL2O3).
3. LEAD MATERIAL: KOVAR, PLATED BY 150
MINIMUM NICKEL, PLATED BY 50 MINIMUM GOLD.
BU-61582FX, 70-PIN FLAT PACK CERAMIC PACKAGE MECHANICAL OUTLINE
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