參數(shù)資料
型號(hào): AS5510-DWLT
廠商: ams
文件頁數(shù): 3/19頁
文件大?。?/td> 248K
描述: IC ENCODER MAGNETIC LIN 6-WLCSP
標(biāo)準(zhǔn)包裝: 12,000
傳感范圍: ±50mT
類型: 線性
電源電壓: 2.5 V ~ 3.6 V
電流 - 電源: 3.5mA
電流 - 輸出(最大): 20mA
輸出類型: 數(shù)字式,開漏極
工作溫度: -30°C ~ 85°C
封裝/外殼: *
供應(yīng)商設(shè)備封裝: *
包裝: *
www.ams.com/AS5510
Revision 0.1
2 - 18
AS5510
Datasheet - Contents
Contents
1 General Description..................................................................................................................................................................   1
2 Key Features.............................................................................................................................................................................   1
3 Applications...............................................................................................................................................................................   1
4 Pin Assignments.......................................................................................................................................................................   3
4.1 Pin Descriptions....................................................................................................................................................................................   3
5 Absolute Maximum Ratings......................................................................................................................................................   4
6 Electrical Characteristics...........................................................................................................................................................   5
6.1 DC Characteristics for Digital Inputs and Outputs................................................................................................................................   5
6.1.1 CMOS Input: ADR ....................................................................................................................................................................... 5
6.1.2 CMOS I睠: SDA, SCL.................................................................................................................................................................. 5
6.2 Electrical and Magnetic Specifications.................................................................................................................................................   6
7 Detailed Description..................................................................................................................................................................   7
7.1 Typical Application................................................................................................................................................................................   7
7.2 I睠 Interface..........................................................................................................................................................................................   7
7.2.1 I睠 Interface Data ........................................................................................................................................................................ 8
7.3 I睠 Modes.............................................................................................................................................................................................   9
7.4 SDA, SCL Input Filters .......................................................................................................................................................................   12
7.5 Register Map and Description............................................................................................................................................................   12
8 Package Drawings and Markings...........................................................................................................................................   14
8.1 Chip Scale Package 1.4 x 1.1mm ......................................................................................................................................................   14
8.2 Package Dimensions..........................................................................................................................................................................   14
8.3 Recommended Footprint....................................................................................................................................................................   15
9 Ordering Information...............................................................................................................................................................   17
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