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參數(shù)資料
型號： AS2536
廠商： ams
文件頁數(shù)： 18/26頁
文件大?。?/td> 0K
描述： IC TELEPHONE CMOS MULTIFU 28SOIC
標(biāo)準(zhǔn)包裝： 27
系列： *
Data She et AS25 33-36
austriamicrosystems
Revision 8.10
Page 24 of 25
Packaging
The device is available in the packages outlined below (not
to scale). For exact mechanical package dimensions
please see austriamicrosystemsAG packaging information.
28-pin plastic SOIC (suffix T)
Max. Body Length
18.1mm / 713mil
Max. Body Width
7.6mm / 300mil
Pitch
1.27mm / 50mil
Pin Configuration
28 Pin SOIC (suffix T)
Ordering Information
Device
Order Number
Package
Features
AS2533 T
AS2533U-ZSO-U
28 pin SOIC in tubes
LNR, 4 direct/10 indirect memories
AS2533 F
pls see bottom rows
Dice on foil, sawn
LNR, 4 direct/10 indirect memories
AS2533 W
pls see bottom rows
Dice on wafer
LNR, 4 direct/10 indirect memories
AS2534B T
AS2534U-ZSO-U
28 pin SOIC in tubes
LNR only, no direct/indirect memories (2)
AS2534B F
pls see bottom rows
Dice on Foil, sawn
LNR only, no direct/indirect memories
AS2534B W
pls see bottom rows
Dice on Wafer
LNR only, no direct/indirect memories
AS2534R T
AS2534R-ZSO-U
28 pin SOIC in tubes
LNR only, no direct/indirect memories, ringer fixed (2)
AS2534R F
pls see bottom rows
Dice on Foil, sawn
LNR only, no direct/indirect memories, ringer fixed
AS2534R W
pls see bottom rows
Dice on Wafer
LNR only, no direct/indirect memories, ringer fixed
AS2535 T
AS2535U-ZSO-U
28 pin SOIC
LNR, 12 direct memories
AS2535 F
pls see bottom rows
Dice on Foil, sawn
LNR, 12 direct
AS2535 W
pls see bottom rows
Dice on Wafer
LNR, 12 direct
AS2536 T
AS2535U-ZSO-U
28 pin SOIC
LNR, 4 direct/10 indirect memories
AS2536 F
pls see bottom rows
Dice on Foil, sawn
LNR, 4 direct/10 indirect memories
AS2536 W
pls see bottom rows
Dice on Wafer
LNR, 4 direct/10 indirect memories
AS253x F
AS253xU-ZSW-F
Dice on Foil, sawn
All versions (1)
AS253x W
AS253xU-ZSW
Dice on Wafer
All versions (1)
AS253xR F
AS253xR-ZSW-F
Dice on Foil, sawn
All versions, ringer fixed (1)
AS253xR W
AS253xR-ZSW
Dice on Wafer
All versions, ringer fixed (1)
Please Note:
(1) For wafer delivery or dice-on-foil delivery, the versions can be selected by bond options.
(2) For deliveries as packaged devices (SOIC28), LNR only is tested, direct and indirect memories are not tested!
ams
AG
Technical
content
still
valid
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AS25360FLF 制造商:TT Electronics / IRC 功能描述:AS25360FLF
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AS25361HLF 制造商:TT Electronics / IRC 功能描述:AS25361HLF
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