參數(shù)資料
型號: APE5208
廠商: Aplus Integrated Circuits Inc.
英文描述: LJT 11C 11#12 SKT WALL RECP
中文描述: 成本低廉的語音和旋律合成4位的CPU
文件頁數(shù): 7/7頁
文件大?。?/td> 249K
代理商: APE5208
APExx08
Series
Rev 1.3 2003/8/18
6
6.1 Bonding Diagram of other
APExx08
series
Pad #
1
2
3
4
5
6
7
8
Pad Name
PWM2/Cout
Vdd1
PWM1
GND1
PRA0
PRA1
PRA2
PRA3
X
Y
466
182
58
58
87
87
87
87
Pad #
9
10
11
12
13
14
15
Pad Name
PRB0
PRB1
Vdd2
GND2
OSC
PRB2
PRB3
X
843
953
1063
1059
1059
1059
1059
Y
87
87
87
247
357
467
577
58
58
145
293
403
513
623
733
Chip Size :
APE1508
: 1230 um x 1848 um,
APE2008
: 1230 um x 1848 um
APE3108
: 1230 um x 1848 um,
APE4108
: 1230 um x 2528 um
APE5208
: 1230 um x 2528 um,
APE6308
: 1230 um x 2528 um
ROM
PRB3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1
PRB0
PRA3
PRA2
PRA1
PRA0
GND1
PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size: 80 um x 80 um
* The IC substrate must be connected to GND.
X
Y
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