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參數(shù)資料
| 型號(hào)： | APE5208 |
| 廠商： | Aplus Integrated Circuits Inc. |
| 英文描述： | LJT 11C 11#12 SKT WALL RECP |
| 中文描述： | 成本低廉的語(yǔ)音和旋律合成4位的CPU |
| 文件頁(yè)數(shù)： | 6/7頁(yè) |
| 文件大小： | 249K |
| 代理商： | APE5208 |
APExx08
Series
Rev 1.3 2003/8/18
5
6.0 Bonding Diagram of
APE0508
/
APE1008
Pad #
1
2
3
4
5
6
7
8
Pad Name
PWM2/Cout
Vdd1
PWM1
GND1
PRA0
PRA1
PRA2
PRA3
X
-518
-518
-431
-283
-173
-63
47
157
Y
-195
-479
-603
-603
-574
-574
-574
-574
Pad #
9
10
11
12
13
14
15
Pad Name
PRB0
PRB1
Vdd2
GND2
OSC
PRB2
PRB3
X
267
377
487
489
489
489
489
Y
-574
-574
-574
-414
-304
-194
-84
Chip Size :
APE0508
: 1234 um x 1404 um
APE1008
: 1234 um x 1404 um
ROM
PRB3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1
PRB0
PRA3
PRA2
PRA1
PRA0
GND1
PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
X
Y
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