ProASICPLUS Flash Family FPGAs 2- 42 v5.9 Tristate Buffer Delays Figure 2-23 " />
參數(shù)資料
型號: APA750-FG676I
廠商: Microsemi SoC
文件頁數(shù): 127/178頁
文件大?。?/td> 0K
描述: IC FPGA PROASIC+ 750K 676-FBGA
標準包裝: 40
系列: ProASICPLUS
RAM 位總計: 147456
輸入/輸出數(shù): 454
門數(shù): 750000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 676-BGA
供應商設備封裝: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
2- 42
v5.9
Tristate Buffer Delays
Figure 2-23 Tristate Buffer Delays
Table 2-27 Worst-Case Commercial Conditions
VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max.
tDLH
1
Max.
tDHL
2
Max.
tENZH
3
Max.
tENZL
4
Units
Std.
OTB33PH
3.3 V, PCI Output Current, High Slew Rate
2.0
2.2
2.0
ns
OTB33PN
3.3 V, High Output Current, Nominal Slew Rate
2.2
2.9
2.4
2.1
ns
OTB33PL
3.3 V, High Output Current, Low Slew Rate
2.5
3.2
2.7
2.8
ns
OTB33LH
3.3 V, Low Output Current, High Slew Rate
2.6
4.0
2.8
3.0
ns
OTB33LN
3.3 V, Low Output Current, Nominal Slew Rate
2.9
4.3
3.2
4.1
ns
OTB33LL
3.3 V, Low Output Current, Low Slew Rate
3.0
5.6
3.3
5.5
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
3. tENZH = Enable-to-Pad, Z to High
4. tENZL = Enable-to-Pad, Z to Low
Table 2-28 Worst-Case Commercial Conditions
VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max.
tDLH
1
Max.
tDHL
2
Max.
tENZH
3
Max.
tENZL
4
Units
Std.
OTB25LPHH
2.5 V, Low Power, High Output Current, High Slew Rate5
2.0
2.1
2.3
2.0
ns
OTB25LPHN
2.5 V, Low Power, High Output Current, Nominal Slew Rate5
2.4
3.0
2.7
2.1
ns
OTB25LPHL
2.5 V, Low Power, High Output Current, Low Slew Rate5
2.9
3.2
3.1
2.7
ns
OTB25LPLH
2.5 V, Low Power, Low Output Current, High Slew Rate5
2.7
4.6
3.0
2.6
ns
OTB25LPLN
2.5 V, Low Power, Low Output Current, Nominal Slew Rate5
3.5
4.2
3.8
ns
OTB25LPLL
2.5 V, Low Power, Low Output Current, Low Slew Rate5
4.0
5.3
4.2
5.1
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
3. tENZH = Enable-to-Pad, Z to High
4. tENZL = Enable-to-Pad, Z to Low
5. Low power I/O work with VDDP = 2.5 V ±10% only. VDDP = 2.3 V for delays.
PAD
A
OTBx
A
50%
PAD
VOL
VOH
50%
t
DLH
50%
t
DHL
EN
50%
PAD
VOL
50%
t
ENZL
50%
10%
EN
50%
PAD
GND
V
OH
50%
t
ENZH
50%
90%
VDDP
35 pF
EN
相關PDF資料
PDF描述
APA750-FGG676I IC FPGA PROASIC+ 750K 676-FBGA
HSC43DRAS-S734 CONN EDGECARD 86POS .100 R/A PCB
EP2SGX30DF780I4N IC STRATIX II GX 30K 780-FBGA
25AA160CT-I/MNY IC SRL EEPROM 2KX8 1.8V 8-TDFN
ACC49DRXI-S734 CONN EDGECARD 98POS DIP .100 SLD
相關代理商/技術(shù)參數(shù)
參數(shù)描述
APA750-FG896 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
APA750-FG896A 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
APA750-FG896I 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
APA750-FGB 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs