參數(shù)資料
型號(hào)： AMMC-6222-W50
元件分類： 放大器
英文描述： 7000 MHz - 21000 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
文件頁(yè)數(shù)： 4/12頁(yè)
文件大小： 1547K
代理商： AMMC-6222-W50
Assembly Techniques
ThebacksideoftheMMICchipisRFground.Formicrostrip
applications the chip should be attached directly to
the ground plane (e.g. circuit carrier or heatsink) using
electricallyconductiveepoxy[1,2].
Forbestperformance,thetopsideoftheMMICshouldbe
broughtuptothesameheightasthecircuitsurroundingit.
Thiscanbeaccomplishedbymountingagoldplatedmetal
shim(samelengthastheMMIC)underthechipwhichisof
correctthicknesstomakethechipandadjacentcircuitthe
sameheight.Theamountofepoxyusedforthechipor
shimattachmentshouldbejustenoughtoprovideathin
filletaroundthebottomperimeterofthechip.Theground
plane should be free of any residue that may jeopardize
electricalormechanicalattachment.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
seriesinductance.Asinglebondwireisnormallysufficient
for signal connections, however double bonding with
0.7mil gold wire will reduce series inductance. Gold
thermo-sonicwedgebondingisthepreferredmethodfor
wireattachmenttothebondpads.Therecommendedwire
bondstagetemperatureis150°c±2°c.
Caution should be taken to not exceed the Absolute
MaximumRatingforassemblytemperatureandtime.
Thechipis100umthickandshouldbehandledwithcare.
ThisMMIChasexposedairbridgesonthetopsurfaceand
shouldbehandledbytheedgesorwithacustomcollet(do
notpickupthediewithavacuumondiecenter).Bonding
padsandchipbacksidemetallizationaregold.
This MMIC is also static sensitive and ESD precautions
shouldbetaken
Notes:
1. Ablebond84-1LMIsilverepoxyisrecommended
2.Eutecticattachisnotrecommendedandmayjeopardizereliabilityof
thedevice.
Ordering Information:
AMMC-6222-W10=10devicespertray
AMMC-6222-W50=50devicespertray
Figure 22. Bond Pad Locations
0
390
800
0
800
1280
1400
2000
800
390
0
1740
650
130
1610
RFin
RFout
VD1
VD2
680
250
SELECT
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright 2005-200 Avago Technologies Limited. All rights reserved. Obsoletes AV0-049EN
AV02-299EN - June 2, 200
相關(guān)PDF資料
PDF描述
AMMC-6333-W10 18000 MHz - 33000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMC-6333-W50 18000 MHz - 33000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMC-6630-W10 5000 MHz - 45000 MHz RF/MICROWAVE VARIABLE ATTENUATOR
AMMC-6630-W50 5000 MHz - 45000 MHz RF/MICROWAVE VARIABLE ATTENUATOR
AMMC-6640 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR
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AMMC-6231-W50 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
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