參數(shù)資料
型號: ADUM3200ARZ
廠商: ANALOG DEVICES INC
元件分類: 模擬信號調(diào)理
英文描述: Dual-Channel, Digital Isolators, Enhanced System-Level ESD Reliability
中文描述: SPECIALTY ANALOG CIRCUIT, PDSO8
封裝: ROHS COMPLIANT, MS-012AA, SOIC-8
文件頁數(shù): 16/20頁
文件大?。?/td> 222K
代理商: ADUM3200ARZ
ADuM3200/ADuM3201
Rev. 0 | Page 16 of 20
MAGNETIC FIELD FREQUENCY (Hz)
100
M
D
0.001
1M
10
0.01
1k
10k
10M
0.1
1
100M
100k
0
Figure 13. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event were to occur during a transmitted
pulse (and had the worst-case polarity), it would reduce the
received pulse from >1.0 V to 0.75 V—still well above the 0.5 V
sensing threshold of the decoder.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances away from the
ADuM320x transformers. Figure 14 expresses these allowable
current magnitudes as a function of frequency for selected
distances. As seen, the ADuM320x are extremely immune and
can be affected only by extremely large currents operated at
high frequency and very close to the component. For the 1 MHz
example, one would have to place a 0.5 kA current 5 mm away
from the ADuM320x to affect the component’s operation.
MAGNETIC FIELD FREQUENCY (Hz)
M
1000
100
10
1
0.1
0.01
1k
10k
100M
100k
1M
10M
DISTANCE = 5mm
DISTANCE = 1m
DISTANCE = 100mm
0
Figure 14. Maximum Allowable Current for Various
Current-to-ADuM320x Spacings
Note that at combinations of strong magnetic fields and high
frequencies, any loops formed by printed circuit board traces
could induce sufficiently large error voltages to trigger the
threshold of succeeding circuitry. Care should be taken in the
layout of such traces to avoid this possibility.
POWER CONSUMPTION
The supply current at a given channel of the ADuM320x
isolator is a function of the supply voltage, the channel’s data
rate, and the channel’s output load.
For each input channel, the supply current is given by
I
DDI
= I
DDI
(
Q
)
I
DDI
= I
DDI
(
D
)
× (2
f – f
r
) +
I
DDI (Q)
f
≤ 0.5
f
r
f > 0.5
f
r
for each output channel, the supply current is given by
I
DDO
= I
DDO
(
Q
)
I
DDO
= (
I
DDO
(
D
)
+ (0.5 × 10
3
) ×
C
L
V
DDO
) × (2
f – f
r
) +
I
DDO
(
Q
)
f
≤ 0.5
f
r
f
> 0.5
f
r
where:
I
DDI (D)
,
I
DDO (D)
are the input and output dynamic supply currents
per channel (mA/Mbps).
C
L
is the output load capacitance (pF).
V
DDO
is the output supply voltage (V).
f
is the input logic signal frequency (MHz, half of the input data
rate, NRZ signaling).
f
r
is the input stage refresh rate (Mbps).
I
DDI (Q)
,
I
DDO (Q)
are the specified input and output quiescent
supply currents (mA).
To calculate the total I
DD1
and I
DD2
supply current, the supply
currents for each input and output channel corresponding to
I
DD1
and I
DD2
are calculated and totaled. Figure 6 provides per-
channel input supply currents as a function of data rate. Figure 7
and Figure 8 provide per-channel output supply currents as a
function of data rate for an unloaded output condition and for a
15 pF output condition, respectively. Figure 9 through Figure 11
provide total I
DD1
and I
DD2
supply current as a function of data
rate for ADuM3200 and ADuM3201 channel configurations.
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ADUM3200ARZ-RL7 Dual-Channel, Digital Isolators, Enhanced System-Level ESD Reliability
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