參數(shù)資料
型號(hào)： ADSP-BF592KCPZ-2
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 35/44頁(yè)
文件大?。?/td> 0K
描述： IC DSP CTRLR 200MHZ 64LFCSP
視頻文件： Blackfin? BF592 Introduction
特色產(chǎn)品： Blackfin Embedded Processor
標(biāo)準(zhǔn)包裝： 1
系列： Blackfin®
類(lèi)型： 定點(diǎn)
接口： I²C，I²S，IrDA，PPI，SPI，SPORT，UART
時(shí)鐘速率： 200MHz
非易失內(nèi)存： ROM（64 kB）
芯片上RAM： 64kB
電壓 - 輸入/輸出： 1.8V，2.5V，3.3V
電壓 - 核心： 1.29V
工作溫度： 0°C ~ 70°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 64-VFQFN 裸露焊盤(pán)，CSP
供應(yīng)商設(shè)備封裝： 64-LFCSP-VQ（9x9）
包裝： 托盤(pán)
Rev. B
|
Page 40 of 44
|
July 2013
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
TJ = junction temperature (°C)
TCASE = case temperature (°C) measured by customer at top cen-
ter of package.
JT = from Table 32
PD = power dissipation (see Total Power Dissipation on Page 19
for the method to calculate PD)
Values of JA are provided for package comparison and printed
circuit board design considerations. JA can be used for a first
order approximation of TJ by the equation:
where:
TA = ambient temperature (°C)
Values of JC are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required.
Values of JB are provided for package comparison and printed
circuit board design considerations.
In Table 32, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 32. Thermal Characteristics
Parameter
Condition
Typical
Unit
θJA
0 linear m/s air flow
23.5
°C/W
θJMA
1 linear m/s air flow
20.9
°C/W
θJMA
2 linear m/s air flow
20.2
°C/W
θJB
11.2
°C/W
θJC
9.5
°C/W
ΨJT
0 linear m/s air flow
0.21
°C/W
ΨJT
1 linear m/s air flow
0.36
°C/W
ΨJT
2 linear m/s air flow
0.43
°C/W
TJ
TCASE
JT
PD
+
=
TJ
TA
JA
PD
+
=
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