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ADS7832
6
AIN3
V
REF
+
V
REF
–
DGND
V
D
D7
D6
5
6
7
8
9
10
11
25
24
23
22
21
20
19
A1
A0
CLK
BUSY
HBE
WR
CS
A
A
A
S
V
A
A
C
D
D
D
D
D
D
R
4
3
2
1
28
27
26
12
13
14
15
16
17
18
PIN CONFIGURATIONS
Top View
DIP
Top View
LCC
SFR
AIN0
AIN1
AIN2
AIN3
V
REF
+
V
REF
–
DGND
V
D
D7
D6
D5
D4
D3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
A
AGND
CAL (SHC)
A1
A0
CLK
BUSY
HBE
WR
CS
RD
D0
D1
D2
PACKAGE/ORDERING INFORMATION
MINIMUM
INTEGRAL
NONLINEARITY
MAXIMUM
LSB
SIGNAL-TO-(NOISE +
DISTORTION)
RATIO, dB
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
ADS7832BN
ADS7832BP
69
69
±
3/4
±
3/4
–40
°
C to +85
°
C
–40
°
C to +85
°
C
28-Pin LCC
28-Pin Plastic DIP
251
215
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
V
A
to Analog Ground............................................................................. 7V
V
D
to Digital Ground .............................................................................. 7V
V
to V
............................................................................................
±
0.3V
Analog Ground to Digital Ground.....................................................
±
0.3V
Control Inputs to Digital Ground ................................ –0.3V to V
D
+ 0.3V
Analog Input Voltage to Analog Ground .................... –0.3V to V
+ 0.3V
Maximum Junction Temperature..................................................... 150
°
C
Internal Power Dissipation............................................................. 875mW
Lead Temperature (soldering, 10s)............................................... +260
°
C
(soldering, 3s) ................................................ +360
°
C
Thermal Resistance,
θ
............................................................ 75
°
C/W
Maximum Input Current to Any Pin ...............................................
±
50mA
ESD: Human Body Model .................................................................. 1kV
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.