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參數(shù)資料
| 型號(hào)： | ADG3304BRUZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 13/20頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC XLATOR 4CH 1.2/5.5V 14TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 邏輯功能： | 變換器，雙向 |
| 位數(shù)： | 4 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 邏輯 |
| 數(shù)據(jù)速率： | 50Mbps |
| 通道數(shù)： | 4 |
| 輸出/通道數(shù)目： | 1 |
| 差分 - 輸入:輸出： | 無(wú)/無(wú) |
| 傳輸延遲（最大）： | 6ns |
| 電源電壓： | 1.15 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 14-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-TSSOP |
| 包裝： | 帶卷 (TR) |
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ADG3304
Data Sheet
Rev. D | Page 20 of 20
3.75
BCS SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
1
0.50
BSC
PIN 1
INDICATOR
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
2.25
2.10 SQ
1.95
20
6
16
10
11
15
5
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-
09-
2012-
B
BOTTOM VIEW
EXPOSED
PAD
4.10
4.00 SQ
3.90
Figure 44. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Branding3
Package
Option
ADG3304BRUZ
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BRUZ-REEL
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BRUZ-REEL7
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BCPZ-REEL
40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-1
ADG3304BCPZ-REEL7
40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-1
ADG3304BCBZ-REEL
40°C to +85°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
SDC
CB-12-1
ADG3304BCBZ-REEL7
40°C to +85°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
SDC
CB-12-1
ADG3304WBRUZ-REEL
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
3
Branding on these packages is limited to three characters due to space constraints.
AUTOMOTIVE PRODUCTS
The ADG3304W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
2005–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04860-0-4/13(D)
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| ADG3304BRUZ-REEL7 | 功能描述:IC XLATR BIDIR V-LVL 4CH 14TSSOP RoHS:是 類別:集成電路 (IC) >> 邏輯 - 變換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:100ELT 邏輯功能:變換器 位數(shù):1 輸入類型:TTL 輸出類型:差分 數(shù)據(jù)速率:- 通道數(shù):2 輸出/通道數(shù)目:1 差分 - 輸入:輸出:無(wú)/是 傳輸延遲（最大）:0.6ns 電源電壓:3 V ~ 3.8 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:Digi-Reel® 產(chǎn)品目錄頁(yè)面:1088 (CN2011-ZH PDF) 其它名稱:576-1360-6 |
| ADG3304SRU-EP-RL7 | 功能描述:轉(zhuǎn)換 - 電壓電平 1.2 V - 5.5 V 4-channel BI-DIR TRANS IC RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| ADG3304SRUZ-EP-RL7 | 功能描述:IC XLATR BIDIR 1.15-5.5V 14TSSOP 制造商:analog devices inc. 系列:- 零件狀態(tài):在售 轉(zhuǎn)換器類型:電壓電平 通道類型:雙向 電路數(shù):1 每個(gè)電路的通道數(shù):4 電壓 - VCCA:1.15V ~ 5.5V 電壓?- VCCB:1.65V ~ 5.5V 輸入信號(hào):- 輸出信號(hào):- 輸出類型:三態(tài)，非反相 數(shù)據(jù)速率:50Mbps 工作溫度:-55°C ~ 125°C（TA） 特性:- 安裝類型:表面貼裝 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商器件封裝:14-TSSOP 標(biāo)準(zhǔn)包裝:1,000 |
| ADG3304WBRUZ-REEL | 制造商:Analog Devices 功能描述: |
| ADG3308 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Voltage 1.2 V to 5.5 V, Bidirectional, Logic Level Translators |
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