![](http://datasheet.mmic.net.cn/Analog-Devices-Inc/ADF4360-0BCPZRL7_datasheet_100747/ADF4360-0BCPZRL7_22.png)
ADF4360-0
Data Sheet
Rev. C | Page 22 of 24
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-2
04-
09-
2012-
A
1
0.50
BSC
PIN 1
INDICATOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.45
2.30 SQ
2.15
24
7
19
12
13
18
6
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 23. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Frequency Range
Package Description
Package Option
ADF4360-0BCPZ
40°C to +85°C
2400 MHz to 2725 MHz
24-Lead LFCSP_VQ
CP-24-2
ADF4360-0BCPZRL
40°C to +85°C
2400 MHz to 2725 MHz
24-Lead LFCSP_VQ
CP-24-2
ADF4360-0BCPZRL7
40°C to +85°C
2400 MHz to 2725 MHz
24-Lead LFCSP_VQ
CP-24-2
EV-ADF4360-0EB1Z
Evaluation Board
1 Z = RoHS Compliant Part.