參數(shù)資料
型號(hào): AD9777EB
廠商: Analog Devices, Inc.
英文描述: 16-Bit, 160 MSPS 2X/4X/8X Interpolating Dual TxDAC+ D/A Converter
中文描述: 16位,160 MSPS的2X/4X/8X TxDAC系列插雙D / A轉(zhuǎn)換
文件頁(yè)數(shù): 5/48頁(yè)
文件大?。?/td> 6021K
代理商: AD9777EB
REV. 0
AD9777
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9777 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
DIGITAL SPECIFICATIONS
Parameter
Min
Typ
Max
Unit
DIGITAL INPUTS
Logic “1” Voltage
Logic “0” Voltage
Logic “1” Current
Logic “0” Current
Input Capacitance
2.1
3
0
V
V
μ
A
μ
A
pF
0.9
+10
+10
–10
–10
5
CLOCK INPUTS
Input Voltage Range
Common-Mode Voltage
Differential Voltage
0
0.75
0.5
3
2.25
V
V
V
1.5
1.5
Specifications subject to change without notice.
(T
to T
, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, DVDD = 3.3 V, I
OUTFS
= 20 mA, unless
otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
*
Parameter
With Respect to
Min
Max
Unit
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, REFLO, FSADJ1/2
I
OUTA
, I
OUTB
P1B15–P1B0, P2B15–P2B0
DATACLK, PLL_LOCK
CLK+, CLK–, RESET
LPF
SPI_CSB, SPI_CLK,
SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
–0.3
–4.0
–0.3
–0.3
–1.0
–0.3
–0.3
–0.3
–0.3
–0.3
+4.0
+4.0
+0.3
AVDD + 0.3
AVDD + 0.3
DVDD + 0.3
DVDD + 0.3
CLKVDD + 0.3
CLKVDD + 0.3
DVDD + 0.3
V
V
V
V
V
V
V
V
V
V
+125
+150
+300
°
C
°
C
°
C
–65
*
Stresses above those listed under the ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
80-Lead Thermally Enhanced
TQFP Package
JA
= 23.5
°
C/W
*
*
With thermal pad soldered to PCB.
ORDERING GUIDE
Temperature
Range
–40
°
C to +85
°
C
Package
Description
Package
Option
*
Model
AD9777BSV
AD9777EB
80-Lead TQFP
Evaluation Board
SV-80
*
SV = Thin Plastic Quad Flatpack
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