參數(shù)資料
型號(hào): AD974BRZ
廠商: Analog Devices Inc
文件頁數(shù): 15/20頁
文件大?。?/td> 0K
描述: IC DAS 16BIT 4CH 200KSPS 28SOIC
標(biāo)準(zhǔn)包裝: 1
類型: 數(shù)據(jù)采集系統(tǒng)(DAS)
分辨率(位): 16 b
采樣率(每秒): 200k
數(shù)據(jù)接口: 串行
電壓電源: 模擬和數(shù)字
電源電壓: 4.75 V ~ 5.25 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 28-SOIC W
包裝: 管件
產(chǎn)品目錄頁面: 776 (CN2011-ZH PDF)
配用: EVAL-AD974CB-ND - BOARD EVAL FOR AD974
REV. A
AD974
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD974 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Analog Inputs
VxA, VxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
CAP . . . . . . . . . . . . . . . . +VANA + 0.3 V to AGND2 – 0.3 V
REF . . . . . . . . . . . . . . . . . . . . Indefinite Short to AGND2,
Momentary Short to VANA
Ground Voltage Differences
DGND, AGND1, AGND2 . . . . . . . . . . . . . . . . . . .
±0.3 V
Supply Voltages
VANA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
VDIG to VANA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±7 V
VDIG
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Digital Inputs . . . . . . . . . . . . . . . . . . . –0.3 V to VDIG + 0.3 V
Internal Power Dissipation2
PDIP (N), SOIC (R), SSOP (RS) . . . . . . . . . . . . . 700 mW
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature Range N, R . . . . . . . . –65
°C to +150°C
Lead Temperature Range
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
28-Lead PDIP:
θ
JA = 100°C/W, θJC = 31°C/W
28-Lead SOIC:
θ
JA = 75°C/W, θJC = 24°C/W
28-Lead SSOP:
θ
JA = 109°C/W, θJC = 39°C/W
PIN CONFIGURATION
SOIC, DIP AND SSOP
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD974
DGND
EXT/
INT
PWRD
VDIG
R/
C
AGND2
REF
AGND1
V3A
V3B
V4A
CAP
BIP
V4B
SYNC
DATACLK
DATA
WR2
WR1
CS
BUSY
V2B
V2A
V1B
V1A
A1
A0
VANA
TO OUTPUT
PIN
CL
100pF
IOL
+1.4V
IOH
1.6mA
500 A
Figure 1. Load Circuit for Digital Interface Timing
ORDERING GUIDE
Temperature
Package
Model
Range
Max INL
Min S/(N+D)
Description
Options
AD974AN
–40
°C to +85°C
±3.0 LSB
83 dB
28-Lead Plastic DIP
N-28B
AD974BN
–40
°C to +85°C
±2.0 LSB
85 dB
28-Lead Plastic DIP
N-28B
AD974AR
–40
°C to +85°C
±3.0 LSB
83 dB
28-Lead SOIC
R-28
AD974BR
–40
°C to +85°C
±2.0 LSB
85 dB
28-Lead SOIC
R-28
AD974ARS
–40
°C to +85°C
±3.0 LSB
83 dB
28-Lead SSOP
RS-28
AD974BRS
–40
°C to +85°C
±2.0 LSB
85 dB
28-Lead SSOP
RS-28
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