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| 型號： | AD9523-1/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 32/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR AD9523-1 |
| 設(shè)計資源： | AD9523(-1) Eval Board Schematic AD9523(-1) BOM AD9523(-1) Gerber Files |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計時，時鐘發(fā)生器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | AD9523 |
| 主要屬性： | 板載 PLL 環(huán)路濾波器 |
| 次要屬性： | LED 狀態(tài)指示器 |
| 已供物品： | 板 |
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AD9523-1
Rev. B | Page 38 of 60
POWER DISSIPATION AND THERMAL CONSIDERATIONS
CLOCK SPEED AND DRIVER MODE
The AD9523-1 is a multifunctional, high speed device that
targets a wide variety of clock applications. The numerous
innovative features contained in the device each consume
incremental power. If all outputs are enabled in the maximum
frequency and mode that have the highest power, the safe
thermal operating conditions of the device may be exceeded.
Careful analysis and consideration of power dissipation and
thermal management are critical elements in the successful
application of the AD9523-1 device.
Clock speed directly and linearly influences the total power
dissipation of the device and, therefore, the junction temperature.
Two operating frequencies are listed under the incremental power
dissipation parameter in Table 3. Using linear interpretation is
a sufficient approximation for frequency not listed in the table.
When calculating power dissipation for thermal consideration,
the amount of power dissipated in the 100 Ω resistor should be
removed. If using the data in Table 2, this power is already
removed. If using the current vs. frequency graphs provided in
the Typical Performance Characteristics section, the power into
the load must be subtracted, using the following equation:
The AD9523-1 device is specified to operate within the
industrial temperature range of –40°C to +85°C. This
specification is conditional, however, such that the absolute
maximum junction temperature is not exceeded (as specified
in Table 16). At high operating temperatures, extreme care must
be taken when operating the device to avoid exceeding the
junction temperature and potentially damaging the device.
Ω
100
2
Swing
Voltage
Output
al
Differenti
EVALUATION OF OPERATING CONDITIONS
Many variables contribute to the operating junction temperature
within the device, including
The first step in evaluating the operating conditions is to
determine the maximum power consumption (PD) internal
to the AD9523-1. The maximum PD excludes power dissipated
in the load resistors of the drivers because such power is external
to the device. Use the power dissipation specifications listed in
Table 3 to calculate the total power dissipated for the desired
configuration. The base typical configuration parameter in
Table 3 lists a maximum power of 434.7 mW, which includes
one LVPECL output at 122.88 MHz. For one LVDS output that
is operating at 122.88 MHz, the power is 35 mW; for operation
at 983.04 MHz, the power is 106 mW. Using linear interpolation,
the power for operation at 245.76 MHz is 45 mW. Table 29
summarizes the incremental power dissipation from the base
power configuration for two different examples.
Table 29. Temperature Gradient Examples
Description
Mode
Selected driver mode of operation
Output clock speed
Supply voltage
Ambient temperature
The combination of these variables determines the junction
temperature within the AD9523-1 device for a given set of
operating conditions.
The AD9523-1 is specified for an ambient temperature (TA). To
ensure that TA is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
TJ = TCASE + (ΨJT × PD)
Frequency
(MHz)
Maximum
Power (mW)
Example 1
Base Typical
Configuration
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
PD is the power dissipation of the AD9523-1.
434.7
Output Driver
6 × LVPECL
122.88
306
Output Driver
3 × LVDS
61.44
89
Output Driver
3 × LVDS
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
245.76
135
Total Power
966
Example 2
Base Typical
Configuration
TJ = TA + (θJA × PD)
434.7
Output Driver
13 × LVPECL
where TA is the ambient temperature (°C).
983.04
2066
Total Power
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
2500
Values of ΨJB are provided for package comparison and PCB
design considerations.
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