參數(shù)資料
型號(hào): AD9238BST-40
廠商: Analog Devices Inc
文件頁(yè)數(shù): 39/48頁(yè)
文件大?。?/td> 0K
描述: IC ADC 12BIT DUAL 40MSPS 64-LQFP
產(chǎn)品變化通告: AD9238 Lead Discontinuation 12/Sept/2011
標(biāo)準(zhǔn)包裝: 1
位數(shù): 12
采樣率(每秒): 40M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
功率耗散(最大): 330mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-LQFP(7x7)
包裝: 托盤
輸入數(shù)目和類型: 4 個(gè)單端,單極;2 個(gè)差分,單極
配用: AD9238BCP-65EBZ-ND - BOARD EVAL WITH AD9238BCP-65
AD9238
Rev. C | Page 44 of 48
02640-
077
Figure 58. PCB Bottom-Side Silkscreen
02640-
078
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θJA = 26.4°C/W with this
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array
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