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參數(shù)資料
| 型號(hào)： | AD8628WAUJZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP CHOPPER R-R 5TSOT |
| 設(shè)計(jì)資源： | Precision, Unipolar, Inverting Conversion Using AD5546/56 DAC (CN0022) Precision, Unipolar, Inverting Conversion Using AD5547/57 DAC (CN0026) Precision, Unipolar, Noninverting Configuration for the AD5547/57 DAC (CN0027) Precision, Unipolar, Noninverting Configuration for the AD5546/56 DAC (CN0023) High Precision Digital-to-Analog Conversion Using the 16-Bit AD5542/1, ADR421, and AD8628 (CN0079) |
| 標(biāo)準(zhǔn)包裝： | 10,000 |
| 放大器類型： | 零漂移 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 1 V/µs |
| 增益帶寬積： | 2.5MHz |
| -3db帶寬： | 2.5MHz |
| 電流 - 輸入偏壓： | 30pA |
| 電壓 - 輸入偏移： | 1µV |
| 電流 - 電源： | 850µA |
| 電流 - 輸出 / 通道： | 30mA |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 5 V，±1.35 V ~ 2.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | SOT-23-5 細(xì)型，TSOT-23-5 |
| 供應(yīng)商設(shè)備封裝： | TSOT-23-5 |
| 包裝： | 帶卷 (TR) |
AD8628/AD8629/AD8630
Data Sheet
Rev. J | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Input Voltage
GND – 0.3 V to VS + 0.3 V
Differential Input Voltage1
±5.0 V
Output Short-Circuit Duration to GND
Indefinite
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
HBM 8-Lead SOIC
±7000V
FICDM 8-Lead SOIC
±1500V
FICDM 5-Lead TSOT
±1000V
MM 8-Lead SOIC
±200V
ESD AD8629
HBM 8-Lead SOIC
±4000V
FICDM 8-Lead SOIC
±1000V
ESD AD8630
HBM 14-Lead SOIC
±5000V
FICDM 14-Lead SOIC
±1500V
FICDM 14-Lead TSSOP
±1500V
MM 14-Lead SOIC
±200V
1
Differential input voltage is limited to ±5 V or the supply voltage, whichever
is less.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θJA is specified for worst-case conditions, that is, θJA is specified
for the device soldered in a circuit board for surface-mount
packages. This was measured using a standard two-layer board.
Table 4.
Package Type
θJA
θJC
Unit
5-Lead TSOT (UJ-5)
207
61
°C/W
5-Lead SOT-23 (RJ-5)
230
146
°C/W
8-Lead SOIC_N (R-8)
158
43
°C/W
8-Lead MSOP (RM-8)
190
44
°C/W
14-Lead SOIC_N (R-14)
105
43
°C/W
14-Lead TSSOP (RU-14)
148
23
°C/W
ESD CAUTION
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