參數(shù)資料
型號(hào)： AD8110ASTZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 26/29頁(yè)
文件大小： 0K
描述： IC VIDEO CROSSPOINT SWIT 80LQFP
標(biāo)準(zhǔn)包裝： 1
功能： 視頻交叉點(diǎn)開關(guān)
電路： 1 x 16:8
電壓電源： 雙電源
電壓 - 電源，單路/雙路(±)： ±4.5 V ~ 5.5 V
電流 - 電源： 38mA
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 80-LQFP
供應(yīng)商設(shè)備封裝： 80-LQFP（12x12）
包裝： 托盤
REV. A
AD8110/AD8111
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8110/AD8111 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V
Internal Power Dissipation
2
AD8110/AD8111 80-Lead Plastic LQFP (ST) . . . . . 2.6 W
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±VS
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range . . . . . . . . . . . . –65
°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air (TA = 25
°C):
80-lead plastic LQFP (ST):
θJA = 48°C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8110/AD8111 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150
°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175
°C for an extended
period can result in device failure.
While the AD8110/AD8111 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150
°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 3.
AMBIENT TEMPERATURE – C
5.0
MAXIMUM
POWER
DISSIPATION
–
Watts 4.0
0
–50
80
–40 –30 –20 –10
0
10
20
30 40
50
60 70
3.0
2.0
1.0
TJ = 150 C
90
Figure 3. Maximum Power Dissipation vs. Temperature
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Option
AD8110AST
–40
°C to +85°C
80-Lead Plastic LQFP (12 mm
× 12 mm)
ST-80A
AD8111AST
–40
°C to +85°C
80-Lead Plastic LQFP (12 mm
× 12 mm)
ST-80A
AD8110-EB
Evaluation Board
AD8111-EB
Evaluation Board
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