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參數(shù)資料
| 型號： | AD7877ACP-REEL7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 消費家電 |
| 英文描述： | Touch Screen Controller |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, QCC32 |
| 封裝： | 5 X 5 MM, MO-220VHHD-2, LFCSP-32 |
| 文件頁數(shù)： | 32/44頁 |
| 文件大?。?/td> | 1002K |
| 代理商： | AD7877ACP-REEL7 |
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AD7877
GROUNDING AND LAYOUT
It is recommended that the ground pins, AGND and DGND, be
shorted together as close as possible to the device itself on the
user’s PCB.
Rev. A | Page 32 of 44
For more information on grounding and layout considerations
for the AD7877, refer to the
Layout and Grounding Recommen-
dations for Touch Screen Digitizers Technical Note
.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGES
The lands on the chip scale package (CP-32) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the pad.
This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm and the via barrel should be plated with 1 oz.
copper to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
0
HOST
NC = NO CONNECT
AD7877
24
NC
21
GPIO4
20
STOPACQ
19
DIN
17
PENIRQ
18
CS
22
ALERT
23
DAV
NC
1
BAT2
2
BAT1
3
AUX3/GPIO3
4
AUX2/GPIO2
5
AUX1/GPIO1
6
V
CC
7
NC
8
N
32
V
R
31
A
30
A
29
V
D
28
D
27
D
26
N
25
N
9
X
10
Y
11
X
12
Y
13
A
14
D
15
N
16
INT1
S
I
INT2
SCLK
MISO
MOSI
PENIRQ
CS
GPIO
HSYNC SIGNAL
FROM LCD
V
CC
R
RNG
0.1
μ
F
DC-DC
CONVERTER
V
IN
OUT
FB
TO LCD
BACKLIGHT
TOUCH
SCREEN
0.1
μ
F
1.0
μ
F–10
μ
F
(OPTIONAL)
VOLTAGE
REGULATOR
TEMPERATURE
MEASUREMENT
DIODE
MAIN
BATTERY
SECONDARY
BATTERY
FROM AUDIO
REMOTE CONTROL
FROM
HOTSYNC INPUTS
Figure 47. Typical Application Circuit
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相關(guān)代理商/技術(shù)參數(shù) |
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| AD7877ACPZ | 制造商:Analog Devices 功能描述:TOUCH SCREEN CNTRLR 32LFCSP - Bulk |
| AD7877ACPZ-500RL7 | 功能描述:IC ADC 12BIT TOUCHSCREEN 32LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標準包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準:- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
| AD7877ACPZ-REEL | 功能描述:IC ADC 12BIT TOUCHSCREEN 32LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標準包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準:- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
| AD7877ACPZ-REEL7 | 功能描述:IC ADC 12BIT TOUCHSCREEN 32LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標準包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準:- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
| AD7877WACPZ-REEL7 | 功能描述:IC CTRLR TOUCH SCREEN 32LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 觸摸屏控制器 系列:- 標準包裝:96 系列:- 類型:- 觸摸面板接口:- 輸入數(shù)/鍵:- 分辨率（位）:- 評估套件:* 數(shù)據(jù)接口:- 數(shù)據(jù)速率/采樣率 (SPS，BPS):- 電壓基準:- 電源電壓:- 電流 - 電源:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
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