參數(shù)資料
型號： AD7858LBRZ
廠商： Analog Devices Inc
文件頁數(shù)： 29/32頁
文件大?。?/td> 0K
描述： IC ADC 12BIT 8CHAN SRL 24SOIC
標準包裝： 31
位數(shù)： 12
采樣率（每秒）： 100k
數(shù)據(jù)接口： 8051，QSPI?，串行，SPI? µP
轉(zhuǎn)換器數(shù)目： 2
功率耗散（最大）： 33mW
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-SOIC（0.295"，7.50mm 寬）
供應商設備封裝： 24-SOIC W
包裝： 管件
輸入數(shù)目和類型： 8 個單端，單極；4 個偽差分，單極
REV. B
–6–
AD7858/AD7858L
ORDERING GUIDE
Linearity
Power
Error
Dissipation Package
Model
(LSB)
1
(mW)
Options
2
AD7858AN
±1
20
N-24
AD7858BN
±1/2
20
N-24
AD7858LAN
3
±1
6.85
N-24
AD7858LBN3
±1
6.85
N-24
AD7858AR
±1
20
R-24
AD7858BR
±1/2
20
R-24
AD7858LAR3
±1
6.85
R-24
AD7858LBR
3
±1
6.85
R-24
AD7858LARS
3
±1
6.85
RS-24
EVAL-AD7858CB4
EVAL-CONTROL BOARD
5
NOTES
1Linearity error here refers to integral linearity error.
2N = Plastic DIP; R = SOIC; RS = SSOP.
3L signifies the low-power version.
4This can be used as a stand-alone evaluation board or in conjunction with the EVAL-
CONTROL BOARD for evaluation/demonstration purposes.
5This board is a complete unit allowing a PC to control and communicate with all
Analog Devices evaluation boards ending in the CB designators.
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . .
±10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260
°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . 75
°C/W (SOIC) 115°C/W (SSOP)
θJC Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
PIN CONFIGURATIONS
DIP, SOIC, AND SSOP
13
16
15
14
24
23
22
21
20
19
18
17
TOP VIEW
(Not to Scale)
12
11
10
9
8
1
2
3
4
7
6
5
AD7858/
AD7858L
CONVST
DIN
CLKIN
SCLK
SYNC
BUSY
SLEEP
REFIN/REFOUT
DVDD
DGND
DOUT
AVDD
AGND
CREF1
CREF2
AIN1
AIN2
AIN7
AIN8
CAL
AIN3
AIN4
AIN6
AIN5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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