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參數資料
| 型號： | 89HPES16T4G2ZBBXG |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 總線控制器 |
| 英文描述： | PCI BUS CONTROLLER, PBGA288 |
| 封裝： | 23 X 23 MM, 1 MM PITCH, GREEN, SBGA-288 |
| 文件頁數： | 7/31頁 |
| 文件大?。?/td> | 580K |
| 代理商： | 89HPES16T4G2ZBBXG |
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September 13, 2010
IDT 89HPES16T4G2 Data Sheet
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
(and also listed below).
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 13 (and also listed below).
Thermal Considerations
This section describes thermal considerations for the PES16T4G2 (23mm2 SBGA288 package). The data in Table 17 below contains information
that is relevant to the thermal performance of the PES16T4G2 switch.
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the TJ(max) value
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
θJA) for the worst case scenario must be
maintained below the value determined by the formula:
θJA = (TJ(max) - TA(max))/P
Given that the values of TJ(max), TA(max), and P are known, the value of desired θJA becomes a known entity to the system designer. How to
achieve the desired
θJA is left up to the board or system designer, but in general, it can be achieved by adding the effects of θJC (value
provided in Table 17), thermal resistance of the chosen adhesive (
θCS), that of the heat sink (θSA), amount of airflow, and properties of the
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
Number of active
Lanes per Port
Core Supply
PCIe Analog
Supply
PCIe Analog
High Supply
PCIe Termin-
ation Supply
I/O Supply
Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
2.5V
Max
2.75V
Typ
1.0V
Max
1.1V
Typ
3.3V
Max
3.465V
Typ
Power
Max
Power
4/4/4/4
(Full swing)
mA
650
908
650
770
260
330
361
429
3
4
Watts
0.65
1.0
0.65
0.85
0.65
0.91
0.36
0.47
0.01
0.02
2.32
3.24
4/4/1/1
(Full swing)
mA
500
660
440
550
150
220
160
165
3
4
Watts
0.5
0.73
0.44
0.61
0.38
0.61
0.16
0.18
0.01
0.02
1.48
2.13
Table 16 PES16T4G2 Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oCMaximum
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
19.8
oC/W
Zero air flow
13.3
oC/W
1 m/S air flow
11.8
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
9.5
oC/W
θJC
Thermal Resistance, Junction-to-Case
1.1
oC/W
P
Power Dissipation of the Device
3.24
Watts
Maximum
Table 17 Thermal Specifications for PES16T4G2, 23x23 mm SBGA288 Package
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相關代理商/技術參數 |
參數描述 |
|---|---|
| 89HPES16T4G2ZBBXG8 | 功能描述:開關 IC - 各種 RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| 89HPES16T4G2ZBBXGI | 制造商:Integrated Device Technology Inc 功能描述:484 BGA (GREEN) - Bulk |
| 89HPES16T4G2ZBBXI | 功能描述:開關 IC - 各種 RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| 89HPES16T4G2ZBBXI8 | 功能描述:開關 IC - 各種 RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| 89HPES16T4ZHBC | 功能描述:Switch Interfacing Interface 484-CABGA (23x23) 制造商:idt, integrated device technology inc 系列:PRECISE?? 包裝:托盤 零件狀態(tài):有效 應用:開關接口 接口:PCI Express 電壓 - 電源:3.3V 封裝/外殼:484-BGA 供應商器件封裝:484-CABGA（23x23） 安裝類型:表面貼裝 標準包裝:60 |
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