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參數(shù)資料
| 型號： | 8535AG-21LFT |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 8535 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO14 |
| 封裝： | 4.40 X 5 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-14 |
| 文件頁數(shù)： | 2/15頁 |
| 文件大小： | 835K |
| 代理商： | 8535AG-21LFT |
ICS8535-21
LOW SKEW, 1-TO-2 LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
IDT / ICS 3.3V LVPECL FANOUT BUFFER
10
ICS8535AG-21 REV. A FEBRUARY 24, 2009
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS535-21.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8535-21 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 50mA = 173.25mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.3V, with all outputs switching) = 173.25mW + 60mW = 233.25mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate
air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 85.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.233W * 85.5°C/W = 90°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 6. Thermal Resitance θJA for 48 Lead TQFP, Forced Convection
θ
JA vs. Air Flow
Linear Feet per Minute
0200
500
Single-Layer PCB, JEDEC Standard Test Boards
146.4°C/W
125.2°C/W
112.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
93.2°C/W
85.5°C/W
81.2°C/W
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 8535AG-21T | 制造商:Integrated Device Technology Inc 功能描述:CLOCK DRVR 2-IN LVPECL 14TSSOP - Tape and Reel |
| 8535AG-31 | 制造商:Integrated Device Technology Inc 功能描述:Clock Driver 2-IN LVPECL 20-Pin TSSOP Tube 制造商:IDT from Components Direct 功能描述:IDT 8535AG-31 CLOCK MANAGEMENT - Rail/Tube 制造商:IDT 功能描述:IDT 8535AG-31 Clock Management |
| 8535AG-31LF | 功能描述:時(shí)鐘緩沖器 1:4 LVCMOS-to-3.3V LVPECL Fanout Buffer RoHS:否 制造商:Texas Instruments 輸出端數(shù)量:5 最大輸入頻率:40 MHz 傳播延遲（最大值）: 電源電壓-最大:3.45 V 電源電壓-最小:2.375 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LLP-24 封裝:Reel |
| 8535AG-31LFT | 功能描述:時(shí)鐘驅(qū)動(dòng)器及分配 1:4 LVCMOS-to-3.3V LVPECL Fanout Buffer RoHS:否 制造商:Micrel 乘法/除法因子:1:4 輸出類型:Differential 最大輸出頻率:4.2 GHz 電源電壓-最大: 電源電壓-最小:5 V 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-8 封裝:Reel |
| 8535AGI-01 | 制造商:Integrated Device Technology Inc 功能描述:IDT 8535AGI-01 CLOCK MANAGEMENT - Rail/Tube 制造商:Integrated Device Technology Inc 功能描述:IDT 8535AGI-01 Clock Management |
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