- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1887 > 73S1217F-68IMR/F/P (Maxim Integrated Products)IC SMART CARD READER PROG 68-QFN PDF資料下載
參數(shù)資料
| 型號(hào)： | 73S1217F-68IMR/F/P |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 78/93頁(yè) |
| 文件大小： | 0K |
| 描述： | IC SMART CARD READER PROG 68-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | 73S12xx |
| 核心處理器： | 80515 |
| 芯體尺寸： | 8-位 |
| 速度： | 24MHz |
| 連通性： | I²C，智能卡，UART/USART，USB |
| 外圍設(shè)備： | LED，POR，WDT |
| 輸入/輸出數(shù)： | 8 |
| 程序存儲(chǔ)器容量： | 64KB（64K x 8） |
| 程序存儲(chǔ)器類型： | 閃存 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 6.5 V |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)當(dāng)前第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)
73S12xxF Software User Guide
UG_12xxF_016
8
Rev. 1.50
CCIDTSC-*.sys/CCIDTSC-*.inf – Teridian Windows Drivers.
ccidusb-*.hex – an embedded application used for USB CCID communications with Windows or
Linux OS. This embedded program can be used with either Microsoft’s generic USB driver or the
Teridian driver.
ccidrs232.hex – an embedded application used for RS232/Serial communications with a host
running Windows OS.
CCID-USB.exe – a PC application written in C# to be used in conjunction with the CCIDTeridian.sys
USB driver with the evaluation board programmed with the CCIDUSB-*.hex firmware.
Low-level API Library – an embedded flash module that provides low-level APIs (physical layer) to
control the 73S12xxF.
High-level API Library – an embedded flash module at the protocol level that provides APIs to control
different features of the Smart Card. EMV Level I protocol layer is implemented within this module.
Include/header files for both the Low-level API and the High-level API libraries.
Sample code for Serial’s Pseudo CCID protocol. For the USB interface, the USB CCID firmware
source code is also included.
Linux driver for USB CCID and Linux Application for USB DFU interface.
2.2
Software Build Environment
Install the Keil compiler and select all default options (recommended). When prompted for a target
device, select TSC-73S12xxF. This option may not be available on older versions of the compiler. In this
case, select TSC 73M6513. For development, an upgrade to a newer version of the Keil compiler is
highly recommended. This option can be changed at any time by:
Under ‘Project’ – ‘Select Device for target ‘Target1’ ‘– CPU tab’ – scroll down to TDK Semiconductor
(with older version of Keil) or Teridian Semiconductor (available with newer version of Keil) – select
either 71M6513 or 73S12xx.
Under ‘Project’ – ‘Options for target ‘target1’’ – Target tab – Xdata memory field, the RAM start
address should be set to 0x0000, and RAM size should be set to 0x0800.
2.2.1
Software Architecture
The 73S12xxF software architecture is partitioned into three separate layers:
The Low-level API (LAPI) device or physical layer, which contains a set of function calls to directly
manage the peripherals and CPU management (such as clock, timing, power saving, etc.).
The second layer is the High-level API (HAPI), which is essentially the protocol layer. It provides
functions for communication with the smart card (ICC).
The third layer is the application layer. This layer is left for the application software developer to
design any suitable smart card reader applications.
Figure 1 shows the partitions for each software component and its approximate memory size. As
illustrated, there are many different ways an application can be designed and implemented. Section 4
Design Reference describes the API functions within each component in more detail. The embedded
application sample source code for most of the main features of the chip is provided in the release.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 73S1217F-68MR/F/PE | IC SOC SMART CARD READER 68QFN |
| 73S8010C-ILR/F | IC SMART CARD INTERFACE 28-SOIC |
| 73S8010R-ILR/F | IC SMART CARD INTERFACE 28-SOIC |
| 73S8014R-IL/F | IC SMART CARD 7816 EMV 20-SOIC |
| 73S8014RN-ILR/F | IC SMART CARD 7816 EMV 20-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 73S1217F-68M/F/PB | 制造商:Maxim Integrated Products 功能描述:OLD P/N 73S1217F-68IM/F/P = NEW P/N 73S1217F-68M/F/PB PIN PD - Rail/Tube |
| 73S1217F-68M/F/PE | 功能描述:8位微控制器 -MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| 73S1217F-68MR/F/PE | 功能描述:8位微控制器 -MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| 73S1217F-EB | 功能描述:開(kāi)發(fā)板和工具包 - 8051 73S1217F Eval Brd (Usb Cable, Doc. Cd) RoHS:否 制造商:Silicon Labs 產(chǎn)品:Development Kits 工具用于評(píng)估:C8051F960, Si7005 核心: 接口類型:USB 工作電源電壓: |
| 73S1217F-EB-Lite | 功能描述:開(kāi)發(fā)板和工具包 - 8051 73S1217F EVB Lite w/Plug & Play/Usb RoHS:否 制造商:Silicon Labs 產(chǎn)品:Development Kits 工具用于評(píng)估:C8051F960, Si7005 核心: 接口類型:USB 工作電源電壓: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。