參數(shù)資料
型號(hào): 5962-9469203QPA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運(yùn)算放大器
英文描述: DUAL OP-AMP, 1500 uV OFFSET-MAX, 0.73 MHz BAND WIDTH, CDIP8
封裝: CERAMIC, DIP-8
文件頁(yè)數(shù): 12/71頁(yè)
文件大小: 1709K
代理商: 5962-9469203QPA
TLC226x, TLC226xA
Advanced LinCMOS
RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177D – FEBRUARY 1997 – REVISED MARCH 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2262 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
0
°C to 70°C
2.5 mV
TLC2262CD
TLC2262CP
TLC2262CPW
40
°Cto125°C
950
V
TLC2262AID
TLC2262AIP
TLC2262AIPW
– 40
°C to 125°C
2.5 mV
TLC2262ID
TLC2262IP
40
°Cto125°C
950
V
TLC2262AQD
– 40
°C to 125°C
2.5 mV
TLC2262QD
– 55
°C to 125°C
950
V
2.5 mV
TLC2262AMFK
TLC2262MFK
TLC2262AMJG
TLC2262MJG
TLC2262AMU
TLC2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25
°C.
TLC2264 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
0
°C to 70°C
2.5 mV
TLC2264CD
TLC2264CN
TLC2264CPW
40
°Cto125°C
950
V
TLC2264AID
TLC2264AIN
TLC2264AIPW
– 40
°C to 125°C
2.5 mV
TLC2264ID
TLC2264IN
40
°Cto125°C
950
V
TLC2264AQD
– 40
°C to 125°C
2.5 mV
TLC2264QD
– 55
°C to 125°C
950
V
2.5 mV
TLC2264AMFK
TLC2264MFK
TLC2264AMJ
TLC2264MJ
TLC2264AMW
TLC2264MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25
°C.
相關(guān)PDF資料
PDF描述
5962-9471901MPA DUAL OP-AMP, CDIP8
5962-9471901M2A DUAL OP-AMP, CQCC8
5962-9472502MPX DUAL OP-AMP, 6000 uV OFFSET-MAX, 92 MHz BAND WIDTH, CDIP8
5962-9472501MCX DUAL OP-AMP, 6000 uV OFFSET-MAX, 92 MHz BAND WIDTH, CDIP14
5962-9472501M2X DUAL OP-AMP, 6000 uV OFFSET-MAX, 92 MHz BAND WIDTH, CQCC20
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