參數(shù)資料
型號: 5962-9089604QPA
廠商: TEXAS INSTRUMENTS INC
元件分類: 運算放大器
英文描述: OP-AMP, 105 uV OFFSET-MAX, 50 MHz BAND WIDTH, CDIP8
封裝: CERAMIC, DIP-8
文件頁數(shù): 1/43頁
文件大?。?/td> 867K
代理商: 5962-9089604QPA
TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS192 – FEBRUARY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Outstanding Combination of dc Precision
and AC Performance:
Unity-Gain Bandwidth...15 MHz Typ
Vn
3.3 nV/
√Hz at f = 10 Hz Typ,
. . . .
2.5 nV/
√Hz at f = 1 kHz Typ
VIO
25
V Max
. . . .
AVD
45 V/
V Typ With RL = 2 k,
. . .
19 V/
V Typ With RL = 600
D Available in Standard-Pinout Small-Outline
Package
D Output Features Saturation Recovery
Circuitry
D Macromodels and Statistical information
description
The TLE20x7 and TLE20x7A contain innovative
circuit design expertise and high-quality process
control techniques to produce a level of ac
performance and dc precision previously unavail-
able in single operational amplifiers. Manufac-
tured using Texas Instruments state-of-the-art
Excalibur process, these devices allow upgrades
to systems that use lower-precision devices.
In the area of dc precision, the TLE20x7 and
TLE20x7A offer maximum offset voltages of
100
V and 25 V, respectively, common-mode
rejection ratio of 131 dB (typ), supply voltage
rejection ratio of 144 dB (typ), and dc gain of
45 V/
V (typ).
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax AT
25
°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
CHIP
FORM
(Y)
0
°Cto70°C
25
V
TLE2027ACD
TLE2037ACD
TLE2027ACP
TLE2037ACP
TLE2027Y
TLE2037Y
0
°C to 70°C
100
V
TLE2027CD
TLE2037CD
TLE2027CP
TLE2037CP
TLE2027Y
TLE2037Y
40
°Cto105°C
25
V
TLE2027AID
TLE2037AID
TLE2027AIP
TLE2037AIP
– 40
°C to 105°C
100
V
TLE2027ID
TLE2037ID
TLE2027IP
TLE2037IP
–55
°Cto125°C
25
V
TLE2027AMD
TLE2037AMD
TLE2027AMFK
TLE2037AMFK
TLE2027AMJG
TLE2037AMJG
TLE2027AMP
TLE2037AMP
– 55 C to 125 C
100
V
TLE2027MD
TLE2037MD
TLE2027MFK
TLE2037MFK
TLE2027MJG
TLE2037MJG
TLE2027MP
TLE2037MP
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2027ACDR).
Chip forms are tested at 25
°C only.
Copyright
1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
OFFSET N1
IN –
IN +
VCC –
OFFSET N2
VCC +
OUT
NC
D, JG, OR P PACKAGE
(TOP VIEW)
3
2
1 20 19
910 11 12 13
4
5
6
7
8
18
17
16
15
14
NC
VCC+
NC
OUT
NC
IN –
NC
IN +
NC
FK PACKAGE
(TOP VIEW)
NC
OFFSET
N1
NC
OFFSET
N2
CC
V
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