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參數(shù)資料
| 型號： | 508669A |
| 英文描述： | IC SMD |
| 中文描述： | 集成電路貼片 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 285K |
| 代理商： | 508669A |
8
LT1180A/LT1181A
PACKAGE DESCRIPTIOU
Dimensions in inches (millimeters) unless otherwise noted.
J Package
16-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
J18 1197
0.015 – 0.060
(0.380 – 1.520)
0.100
±
0.010
(2.540
±
0.254)
0.014 – 0.026
(0.360 – 0.660)
0.045 – 0.068
(1.143 – 1.727)
0.200
(5.080)
MAX
0.125
(3.175)
MIN
0.008 – 0.018
(0.203 – 0.457)
0
°
– 15
°
0.300 BSC
(0.762 BSC)
1
2
3
4
5
6
7
8
0.220 – 0.310
(5.590 – 7.870)
0.960
(24.384)
MAX
0.005
(0.127)
MIN
16
13
9
10
11
12
14
15
17
18
0.025
(0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
J Package
18-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
J16 1197
0.015 – 0.060
(0.380 – 1.520)
0.100
±
0.010
(2.540
±
0.254)
0.014 – 0.026
(0.360 – 0.660)
0.045 – 0.068
(1.143 – 1.727)
0.200
(5.080)
MAX
0.125
(3.175)
MIN
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
0.008 – 0.018
(0.203 – 0.457)
0
°
– 15
°
0.300 BSC
(0.762 BSC)
1
2
3
4
5
6
7
8
0.220 – 0.310
(5.588 – 7.874)
0.840
(21.336)
MAX
0.005
(0.127)
MIN
16
13
9
10
11
12
14
15
0.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
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