參數(shù)資料
型號： 3224W-1-102E
英文描述： TRIMMER SMD CERMET MEHR 1K 300V 0.25W
中文描述： 修邊機表面貼裝金屬陶瓷伊朗Mehr一千300V 0.25W
文件頁數(shù)： 80/86頁
文件大小： 3230K
代理商： 3224W-1-102E
Specifications are subject to change without notice.
84
This application note is designed to provide step-by-step
processing recommendations. It covers the popular SMC
soldering processes currently in use and provides recommenda-
tions and cautions for each step. Since many variations of
temperature, time, processes, cleaning agents and board types
are found in the electronics industry, you’ll want to test and
verify your own system.
The process steps, recommendations and cautions are
based on Bourns Trimpot surveys of SMC users, equipment
manufacturers and materials suppliers. Also, comments
reflect results of Bourns’ testing. Our findings suggest the
following soldering and cleaning processes:
1. SOLDERING - Forced Hot Air, Convection, IR, Vapor Phase
(In-Line), Wave (Single and Dual)
2. CLEANING - Solvent, Aqueous, Semi-Aqueous, No-Clean
On the facing page are the common methods, materials and
maximum temperature/time parameters for soldering and
cleaning processes.
1
Solder Paste
Printing
Reflow
GENERAL
Use the optimum
solder paste for the
pattern, printing
process, solder paste
density and solder
joint quality.
RECOMMENDED
Use Sn 63% Pb 37%
solder paste. Use 8 to
10 mil thickness for
solder paste print.
CAUTION
Since solder paste
usually contains a high
percentage of activators,
you must ensure
adequate cleaning to
remove all residues,
unless no-clean (low
solids) paste is used.
Adhesive
Application
Flow (Wave)
GENERAL
The adhesive must hold
the SM Component
(SMC) in correct
orientation upon place-
ment and maintain
correct trimmer position
during physical
handling before final
solder processing.
RECOMMENDED
To assure positional
stability, place a single
dot of epoxy under the
SMC.
CAUTION
Stability after placement
is a direct function of
the volume of adhesive
used. Use enough epoxy
to assure stability
through the cure
process.
Avoid overflow of epoxy
to solder pad and
terminal areas.
Adhesive
Cure
Flow (Wave)
GENERAL
Use heat/time cure
method with either
convection oven or
infrared radiation.
RECOMMENDED
Cure using the
temperature and
times recommended
by the adhesive
manufacturer.
CAUTION
Use enough cure
time to assure
complete adhesive
transition from fluid
to solid.
Flux
Application
Flow (Wave)
GENERAL
Use the correct flux
to remove surface
oxides, prevent
reoxidation and
promote wetting.
RECOMMENDED
RMA
No-clean SRB
(Synthetic resin
based)
OA (Organic Acid)
(See caution)
CAUTION
Avoid highly
activated fluxes.
Consult factory before
using OA.
SMC
Placement
GENERAL
Use pick-and-place
equipment with
vacuum nozzle ID size
that allows adequate
suction to pick the
SMC out of the
embossed cavity.
RECOMMENDED
The nozzle inside
diameter (ID) should
not exceed .100 in.
(2.54mm) to ensure
adequate suction and
part alignment.
CAUTION
Assure parts are
placed so that all
terminals are
equidistant (<4 mils)
from the solder pads.
Align terminals with
solder belt direction of
travel to avoid body
shadowing effects
during flow soldering.
EPOXY
Soldering And Cleaning Processes
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
3224W-1-102E 制造商:Bourns Inc 功能描述:Trimmer
3224W-1-102E 制造商:Bourns Inc 功能描述:TRIMMER 0.25W 1K 制造商:Bourns Inc 功能描述:TRIMMER, 0.25W, 1K
3224W-1-102G 功能描述:微調(diào)電阻器 - 表面貼裝 4mm 1Kohms 10% Square Cermet Sealed RoHS:否 制造商:Murata 產(chǎn)品:Single-Turn Trimmer Potentiometers 產(chǎn)品類型:Single Turn 轉(zhuǎn)數(shù):1 元件類型:Cermet 錐度:Linear 電阻:10 kOhms 電壓額定值: 端接類型:SMD/SMT 功率額定值:250 mW (1/4 W) 容差:20 % 溫度系數(shù):150 PPM / C
3224W1103E 制造商:Bourns / JW Miller 功能描述:Res Cermet Trimmer 10K Ohm 10% 1/4W 12(Elec)Turn 1.5mm (4.8 X 3.9 X 5.3mm) J-Hook SMD Embossed T/R 制造商:Bourns 功能描述:Res Cermet Trimmer 10K Ohm 10% 1/4W 12(Elec)Turn 1.5mm (4.8 X 3.9 X 5.3mm) J-Hook SMD Embossed T/R
3224W-1-103E 功能描述:微調(diào)電阻器 - 表面貼裝 4mm 10Kohms 10% Square Cermet Sealed RoHS:否 制造商:Murata 產(chǎn)品:Single-Turn Trimmer Potentiometers 產(chǎn)品類型:Single Turn 轉(zhuǎn)數(shù):1 元件類型:Cermet 錐度:Linear 電阻:10 kOhms 電壓額定值: 端接類型:SMD/SMT 功率額定值:250 mW (1/4 W) 容差:20 % 溫度系數(shù):150 PPM / C
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