- 您現在的位置：買賣IC網 > PDF目錄33273 > 2N5640RLRE (ON SEMICONDUCTOR) 30 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92 PDF資料下載
參數資料
| 型號： | 2N5640RLRE |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號晶體管 |
| 英文描述： | 30 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92 |
| 封裝： | PLASTIC, TO-226AA, 3 PIN |
| 文件頁數： | 6/35頁 |
| 文件大?。?/td> | 353K |
| 代理商： | 2N5640RLRE |
第1頁第2頁第3頁第4頁第5頁當前第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁
7–11
Surface Mount Information
Motorola Small–Signal Transistors, FETs and Diodes Device Data
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to mini-
mize the thermal stress to which the devices are subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100
°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10
°C.
The soldering temperature and time should not exceed
260
°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5
°C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make
up a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remem-
bers these profiles from one operating session to the next.
Figure 2 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems, but it is a
good starting point. Factors that can affect the profile include
the type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189
°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
200
°C
150
°C
100
°C
50
°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
°C
150
°C
160
°C
170
°C
140
°C
Figure 2. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
相關PDF資料 |
PDF描述 |
|---|---|
| 2N5640 | 30 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92 |
| 2N5640RL | 30 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92 |
| 2N5658 | 10 A, 80 V, NPN, Si, POWER TRANSISTOR, TO-59 |
| 2N5660 | 2 A, 200 V, NPN, Si, POWER TRANSISTOR, TO-213 |
| 2N6339 | 10 A, 120 V, NPN, Si, POWER TRANSISTOR, TO-204 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 2N5641 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:silicon transistors UHF/VHF power transistors |
| 2N5642 | 制造商:ELCIND 功能描述: |
| 2N5643 | 功能描述:射頻雙極電源晶體管 RF Transistor RoHS:否 制造商:M/A-COM Technology Solutions 配置:Single 直流集電極/Base Gain hfe Min:40 最大工作頻率:30 MHz 集電極—發(fā)射極最大電壓 VCEO:25 V 發(fā)射極 - 基極電壓 VEBO:4 V 集電極連續(xù)電流:20 A 最大直流電集電極電流: 功率耗散:250 W 封裝 / 箱體:Case 211-11 封裝:Tray |
| 2N5646 | 制造商:NJSEMI 制造商全稱:New Jersey Semi-Conductor Products, Inc. 功能描述:SI NPN POWER HF BJI |
| 2N5652 | 制造商: 功能描述: 制造商:undefined 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。