5. SOFTWARE REFERENCE" />
參數(shù)資料
型號(hào): 101-1226
廠商: Rabbit Semiconductor
文件頁數(shù): 107/168頁
文件大?。?/td> 0K
描述: RCM3900 DEV KIT UNIVERSAL
標(biāo)準(zhǔn)包裝: 1
系列: RabbitCore 3900
類型: MPU 模塊
適用于相關(guān)產(chǎn)品: RCM3900
所含物品: RabbitCore 模塊、開發(fā)板、交流適配器、纜線和 Dynamic C? 光盤
其它名稱: 316-1137
RabbitCore RCM3900 User’s Manual
43
5. SOFTWARE REFERENCE
Dynamic C is an integrated development system for writing
embedded software. It runs on an IBM-compatible PC and is
designed for use with Rabbit controllers and other controllers
based on the Rabbit microprocessor. Chapter 5 describes the
libraries and function calls related to the RCM3900.
5.1 More About Dynamic C
Dynamic C has been in use worldwide since 1989. It is specially designed for program-
ming embedded systems, and features quick compile and interactive debugging. A com-
plete reference guide to Dynamic C is contained in the Dynamic C User’s Manual.
You have a choice of doing your software development in the flash memory or in the static
SRAM included on the RCM3900. The flash memory and SRAM options are selected with
the Options > Program Options > Compiler menu.
The advantage of working in RAM is to save wear on the flash memory, which is limited
to about 100,000 write cycles. The disadvantage is that the code and data might not both
fit in RAM.
NOTE: An application should be run from the program execution SRAM after the serial
programming cable is disconnected. Your final code must always be stored in flash
memory for reliable operation. RCM3900 modules have a fast program execution SRAM
that is not battery-backed. Select Code and BIOS in Flash, Run in RAM from the
Dynamic C Options > Project Options > Compiler menu to store the code in flash
and copy it to the fast program execution SRAM at run-time to take advantage of the
faster clock speed. This option optimizes the performance of RCM3900 modules run-
ning at 44.2 MHz.
NOTE: Do not depend on the flash memory sector size or type in your program logic.
The RCM3900 and Dynamic C were designed to accommodate flash devices with
various sector sizes in response to the volatility of the flash-memory market.
Developing software with Dynamic C is simple. Users can write, compile, and test C and
assembly code without leaving the Dynamic C development environment. Debugging occurs
while the application runs on the target. Alternatively, users can compile a program to an
image file for later loading. Dynamic C runs on PCs under Windows 2000 and later—see
Rabbit’s Technical Note TN257, Running Dynamic C With Windows Vista, for
additional information if you are using a Dynamic C release prior to v. 9.60 under Windows
Vista. Programs can be downloaded at baud rates of up to 460,800 bps after the program
compiles.
相關(guān)PDF資料
PDF描述
AIUR-10-102K INDUCTOR POWER 1000UH 10% T/H
AIUR-06-470K INDUCTOR POWER 47UH 10% T/H
V300C28C75B2 CONVERTER MOD DC/DC 28V 75W
AT91SAM9X25-EK KIT EVAL FOR AT91SAM9G25
AT91SAM9G25-EK KIT EVAL FOR AT91SAM9G25
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
10-11-2263 功能描述:集管和線殼 KK 100 Housing Crimp Ramp 26 Ckt RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector
10-11-2264 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.54mm (.100") Pitch KK?? Crimp Terminal Housing, High Pressure, 1 Circuits
10-11-2273 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.54mm (.100") Pitch KK?? Crimp Terminal Housing, High Pressure, 1 Circuits
10-11-2274 功能描述:集管和線殼 KK 100 Housing Crimp Pol Ramp 27 Ckt RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector
10-11-2283 功能描述:集管和線殼 28P HI PRESSURE HSG RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector