124
μ
PD789405, 789406, 789407
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric ield, when exposed o a MOS device, can cause destruction
of he gate oxide and ultimately degrade he device operation. Steps must
be taken to stop generation of static electricity as much as possible, and
quickly dissipate t once, when t has occurred. Environmental control must
be adequate. When t s dry, humidifier should be used. t s ecommended
to avoid using nsulators hat easily build static electricity. Semiconductor
devices must be stored and transported n an anti-static container, static
shielding bag or conductive material. All test and measurement tools
including work bench and loor should be grounded. The operator should
be grounded using wrist strap. Semiconductor devices must not be ouched
with bare hands. Similar precautions need o be aken or PW boards with
semiconductor devices on t.
2 HANDLING OF UNUSED NPUT PINS FOR CMOS
Note: No connection or CMOS device nputs can be cause of malfunction. f no
connection s provided o he nput pins, t s possible hat an nternal nput
level may be generated due o noise, tc., hence ausing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. nput evels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry. Each unused pin should be connected to V
DD
or GND with a
resistor, f t s considered o have a possibility of being an output pin. All
handling related to the unused pins must be udged device by device and
related specifications governing he devices.
3 STATUS BEFORE NITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define nitial tatus of MOS device. Production
process of MOS does not define the nitial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been nitialized. Hence, power-on does not guarantee
out-pin evels, /O settings or contents of egisters. Device s not nitialized
until he eset signal s eceived. Reset operation must be executed mme-
diately after power-on or devices having reset unction.