REV. 1.0.1 Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open D" />
參數(shù)資料
型號： XR16M781IL32-F
廠商： Exar Corporation
文件頁數(shù)： 34/52頁
文件大小： 0K
描述： IC UART FIFO 64B 32QFN
標準包裝： 490
特點： *
通道數(shù)： 1，UART
FIFO's： 64 字節(jié)
規(guī)程： RS232，RS422，RS485
電源電壓： 1.62 V ~ 3.63 V
帶自動流量控制功能： 是
帶IrDA 編碼器/解碼器： 是
帶故障啟動位檢測功能： 是
帶調(diào)制解調(diào)器控制功能： 是
帶CMOS： 是
安裝類型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤
供應商設(shè)備封裝： 32-QFN 裸露焊盤（5x5）
包裝： 托盤
XR16M781
4
1.62V TO 3.63V UART WITH 64-BYTE FIFO AND VLIO INTERFACE
REV. 1.0.1
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
CTS#
18
24
A1
I
UART Clear-to-Send (active low) or general purpose input. It can
be used for auto CTS flow control, see EFR[7], MSR[4] and IER[7].
This input should be connected to VCC when not used.
DTR#
-
22
B3
O
UART Data-Terminal-Ready (active low) or general purpose output.
DSR#
-
25
C4
I
UART Data-Set-Ready (active low) or general purpose input. This
input should be connected to VCC when not used.
CD#
-
26
-
I
UART Carrier-Detect (active low) or general purpose input. This
input should be connected to VCC when not used.
RI#
-
27
-
I
UART Ring-Indicator (active low) or general purpose input. This
input should be connected to VCC when not used.
ANCILLARY SIGNALS
XTAL1
8
10
D5
I
Crystal or external clock input.
XTAL2
9
11
C5
O
Crystal or buffered clock output.
PwrSave
7
9
D4
I
Power-Save (active high). This feature isolates the M781’s data bus
interface from the host preventing other bus activities that cause
higher power drain during sleep mode. See Sleep Mode with Auto
Wake-up and Power-Save Feature section for details. This pin does
not have an internal pull-down resistor. This input should be con-
nected to GND when not used.
RESET#
17
23
A2
O
Device reset (active low). A 40 ns minimum LOW pulse on this pin
will reset the internal registers and all outputs of the UART. The
UART transmitter output will be held HIGH, the receiver input will
be ignored and outputs are reset during reset period (see UART
Reset Conditions).
VCC
19
28
B1
Pwr
1.62V to 3.63V power supply.
GND
11
13
B5
Pwr
Power supply common, ground.
GND
Center
Pad
Center
Pad
-
Pwr
The center pad on the backside of the QFN package is metallic and
should be connected to GND on the PCB. The thermal pad size on
the PCB should be the approximate size of this center pad and
should be solder mask defined. The solder mask opening should be
at least 0.0025" inwards from the edge of the PCB thermal pad.
NC
13
2, 15-18
-
No Connects.
Pin Description
NAME
24-QFN
PIN#
32-QFN
PIN#
25-BGA
PIN#
TYPE
DESCRIPTION
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